Jig for inspecting substrate, and inspection probe

Abstract

To provide a jig for inspecting substrates and an inspection probe to be used for inspecting electrical characteristics of substrates to be inspected. [MEANS FOR SOLVING PROBLEMS] A jig (1) for inspecting substrates is composed of an inspection probe (2) wherein a first end section (23) is electrically in contact with a prescribed inspecting position (101) of a substrate (100) to be inspected; a connecting electrode (4) having an electrode section (41) in electrically contact with a second end section (24) of the inspection probe (2); and a holding body (3) for holding the inspection probe (2). The holding body (3) is provided with a first guide section (31) having a first guide hole (311) for guiding the first end section (23) to the inspection position (101), and a second guide section (32) whereupon a second guide hole (321) is formed for guiding the second end section (24) to the electrode section (41). The inspection probe (2) is composed of a flexible linear conducting section (21) having the first end section (23) and the second end section (24), and an insulating section (22) applied for insulation on an outer circumference of the conducting section (21) excluding the first end section (23) and the second end section (24). The length of the second end section (24) is shorter than that of the second guide hole (321).

Description

Technical field [0001] The present invention relates to a substrate inspection jig and an inspection probe for inspecting the electrical characteristics of an inspected substrate as an inspection target. [0002] In addition, the present invention is not limited to printed wiring substrates, and can be applied to various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and packaging substrates and film carriers for semiconductor packaging. For electrical wiring inspection, in this specification, the various wiring boards mentioned above are collectively referred to as "substrates". Background technique [0003] A wiring pattern composed of many wirings is formed on the substrate. In order to check whether the wiring pattern is completed as designed, various substrate inspection devices have been proposed in the past, and these devices have been put into practical use. [0004] As such a substra...

AI Technical Summary

Problems solved by technology

[0009] However, as disclosed in Patent Document 1 or 2, in the substrate inspection jig J, when the inspection probe P generates a contact pressure and contacts the electrode portion, the inspection probe 2 is inclined relative to the surface of the electrode portion E. Inclined obliquely, whenever a load is applied, the tip of the inspection probe slides on the surface of the electrode part, causing scratches on the wiring, or the contact position between the electrode part E and the inspection probe P moves, resulting in unstable contact

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