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Method of manufacturing solar cell

A technology of solar cells and manufacturing methods, applied in the direction of final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve problems such as chip bending, affecting solar cell structure, conversion efficiency, and reliability, etc., to reduce structural stress and improve The effect of the bending phenomenon

Pending Publication Date: 2008-11-26
GIGASTORAGE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, solar cells made of ultra-thin silicon chips are prone to chip bending due to external forces due to their thin thickness, which indirectly affects the structure, conversion efficiency and reliability of the entire solar cell

Method used

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Embodiment Construction

[0024] Some embodiments of the present invention are described in detail below. However, except for the implementation described in detail, the present invention can be widely implemented in other embodiments, and the claimed scope of the present invention is not limited to the following embodiments. Furthermore, in order to provide a clearer description and easier understanding of the present invention, the various parts in the drawings are not drawn according to their relative sizes, and the irrelevant details are not completely drawn, in order to keep the drawings concise.

[0025] Please refer to the accompanying drawings, which are shown only to illustrate the preferred embodiments of the present invention, and not to limit the present invention. In the solar cell structure of miniaturized ultra-thin silicon chip, in order not to deform the ultra-thin silicon chip, the present invention has discovered through research and development that a buffer layer of special material ca...

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Abstract

Disclosed is a process for preparing solar cells, which comprises that first, preparing a substrate, then, injecting ions into the substrate to form a p-n doped structure by the ion implantation technique, next, forming a buffer layer on the substrate and forming recessed patterns in the buffer layer, and then, forming a metal layer on the buffer layer and filling with the recessed patterns.

Description

Technical field [0001] The present invention relates to a method for manufacturing a solar cell (Solar Cell), in particular to a method of forming a buffer layer on the back of a silicon wafer to reduce the structural stress generated by the thinned solar cell, thereby effectively improving the substrate stress The bending phenomenon caused by the solar cell manufacturing method. Background technique [0002] The recent shortage of energy in the world has led to the continuous soaring of oil prices. Countries around the world have actively invested in the development of energy-saving products, such as solar cells (Solar cells) are the product of this trend. Under the problems of petroleum and environmental protection (global greenhouse effect), global solar cell sales have grown several times. A solar cell is a photoelectric semiconductor component that converts light energy into electrical energy. Its conversion mechanism is: solar radiation is irradiated on the solar cell so th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18
CPCY02P70/50
Inventor 黄文瑞林进章
Owner GIGASTORAGE CORP
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