Radiation detecting unit and radiation inspecting apparatus

Abstract

A detecting board (22) is provided with a wiring board (24), a semiconductor detecting element (25) firmly fixed on the upper plane of the wiring board (24) for detecting radiation and a spacer (28) firmly fixed on the upper plane of the wiring board (24), and a plurality of detecting boards are stacked and fixed. On each of the detecting boards (22), the semiconductor detecting element (25) and the spacer (28) are arranged to have a prescribed positional relationship. Furthermore, the detecting boards (22) are stacked by being aligned by the spacers (28) on an X-Y plane, and are fixed by fixing members (23a, 23b). The spacer (28) is provided with a step section (28e) so that the lower plane of the wiring board (24) is not brought into contact with the spacer (28) under the lower plane, and in the vertical direction, the spacers (28) are positioned by being brought into contact with each other.

Description

technical field [0001] The present invention relates to a radiation detection unit having a radiation semiconductor detection element and a radiation inspection apparatus using the same, and more particularly to a radiation detection unit and a radiation inspection apparatus for detecting gamma rays emitted from radioisotopes in a subject. Background technique [0002] In recent years, tomography apparatuses have been widely used to obtain information on the inside of a living body (subject). Examples of X-ray tomography devices include X-ray computed tomography (X-ray CT) devices, magnetic resonance imaging devices, SPECT (single photon emission CT) devices, and positron emission tomography devices. (PET) device. The X-ray CT device irradiates narrow X-ray beams to a section of the subject from multiple directions, and detects the transmitted X-rays, and then calculates the spatial distribution of the X-ray absorption degree in the section through a computer, so that pict...

AI Technical Summary

Problems solved by technology

As a result, the cost of the substrate 106 increases

Furthermore, it also affects the positioning accuracy of the semiconductor detection element 105 with respect to the substrate 106.

[0007] In this way, there is a problem that it is difficult to arrange the semiconductor detection element 105 with high precision due to overlapping dimensional errors or positioning errors of the substrate 106 and the guide rail 109.

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