Encapsulation method of minitype flat plate hot pipe
A flat plate heat pipe and packaging method technology, applied in indirect heat exchangers, lighting and heating equipment, metal processing equipment, etc., can solve the problems of high processing difficulty and high equipment cost
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[0020] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0021] combine Figure 1-Figure 3 , the specific operation process of the encapsulation method in this embodiment is as follows:
[0022] At the beginning, use sandpaper to lightly polish the welding surfaces of the upper substrate 1 of the micro-plate heat pipe and the lower substrate 2 of the micro-plate heat pipe. force.
[0023] Then thoroughly clean the upper and lower substrates, and after drying, apply flux evenly on the upper and lower substrate welding strips 3 and 4 of the upper and lower substrates, in order to improve the wettability of the melted solder and the welding strips, so that they can be uniform and smooth plated on the solder strip.
[0024] Use a heater (electric soldering iron is used in this embodiment) to heat the solder and the upper and lower substrates at the same time to melt the solder, and apply the melted solder e...
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