A semiconductor component packaging equipment applicable to different types and specifications

Abstract

The invention relates to the field of packaging of semiconductor elements, in particular to packaging equipment applicable to semiconductor elements of different types and specifications. The equipment comprises a stepping conveying belt, a guiding device, a limiting device and a feeding device; the guiding device comprises two guiding polish rods which are arranged at one sides of the stepping conveying belt respectively, each guiding polish rod can move vertically through one lifting device, and the limiting device comprises two guide assemblies which are arranged at one sides of the stepping conveying belt respectively; each guide assembly is always located above the stepping conveying belt and can vertically move through a height fine-adjustment device, the two guide assemblies can bemovably arranged face to face or back to back through spacing fine-adjustment devices, and the feeding device is arranged outside one side of the downstream end of the stepping conveying belt. The equipment can be applicable to automatically packaging the semiconductor elements of different types and specifications, and the product output efficiency of manufacturers is greatly improved.

Description

technical field [0001] The invention relates to the field of semiconductor element packaging, in particular to semiconductor element packaging equipment applicable to different types and specifications. Background technique [0002] A semiconductor component is an electronic component whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor of semiconductor components The material is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. [0003] Semiconductor components need to be transported for short or long distances after production, so semiconductor components need to be packaged during transportation, and the packaging tube with a long strip stru...

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Problems solved by technology

[0003] Semiconductor components need to be transported for short or long distances after production, so semiconductor components need to be packaged during transportation, and the packaging tube with a long strip structure is used to prevent them from being damaged during transportation. Collision damage and static damage to semiconductor components; general manufacturers produce semiconductor components of different types and specifications in the production of semiconductor components, and traditional automatic packaging equipment for semiconductor components cannot meet the requirements of various types and specifications of semiconductor components Packaging work, which leads to a decrease in the overall output efficiency of the manufacturer

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