Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate transfer device, substrate processing apparatus and substrate transfer method

A handover device and substrate technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of reducing wafer processing productivity and achieve the effect of improving productivity and rapid correction

Inactive Publication Date: 2010-06-09
TOKYO ELECTRON LTD
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Meanwhile, as mentioned above, the transfer arm and the mobile transfer robot cannot perform other operations (such as the operation of transferring other wafers), thus reducing the productivity of wafer processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate transfer device, substrate processing apparatus and substrate transfer method
  • Substrate transfer device, substrate processing apparatus and substrate transfer method
  • Substrate transfer device, substrate processing apparatus and substrate transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the structural element which has substantially the same functional structure, and repeated description is abbreviate|omitted.

[0061] Substrate transfer device

[0062] First, a board transfer device according to an embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view for explaining an installation example of each device, figure 2 yes means figure 1Side views of each device shown. In this embodiment, an embodiment of the substrate transfer device 130 for transferring a substrate such as a semiconductor wafer (hereinafter also simply referred to as “wafer”) W between a transfer arm not shown and the mounting table 112 will be described.

[0063] Such as figure 1 , figure 2 As shown,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A substrate transfer device capable of correcting the displacement of a substrate in a horizontal direction by itself without using a transfer arm. The device comprises support pins (132A to 132C) disposed around a support shaft (114) for a load stage (112), separated from the support shaft (114), and supporting a substrate such as a wafer (W) on its lower surface, a base (134) to which the support pins are fitted, a vertical driving means (Z-direction drive means (138Z)) for elevating and lowering the wafer (W) by vertically driving the support pins through the base, and a horizontal drive means (X-direction drive means (138X), Y-direction drive means (138Y)) for adjusting the position of the wafer in horizontal directions (X-, Y-directions) by horizontally driving the support pins through the base.

Description

technical field [0001] The invention relates to a substrate transfer device, a substrate processing device, and a substrate transfer method. Background technique [0002] Generally, in the manufacturing process of a semiconductor integrated circuit, various processes such as film formation, etching, and heat treatment are repeatedly performed on a substrate to be processed, such as a semiconductor wafer (hereinafter, also referred to as "wafer"), to form a wafer. form an integrated circuit. In addition, predetermined post-processing may be performed on the wafers subjected to the above-mentioned processing processes. Examples of post-processing include processing for cleaning the wafer (such as processing to remove deposits adhering to the wafer, etc.), and processing for measuring processing results (such as film thickness measurement processing, particle measurement processing, etc.). [0003] Such wafer processing is performed, for example, by a substrate processing app...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/3065H01L21/68H01L21/205
CPCH01L21/68H01L21/681H01L21/68742H01L21/67259H01L21/67742H01L21/67751H01L21/6875H01L21/68785
Inventor 广木勤
Owner TOKYO ELECTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com