Substrate transfer device, substrate processing apparatus and substrate transfer method

Abstract

A substrate transfer device capable of correcting the displacement of a substrate in a horizontal direction by itself without using a transfer arm. The device comprises support pins (132A to 132C) disposed around a support shaft (114) for a load stage (112), separated from the support shaft (114), and supporting a substrate such as a wafer (W) on its lower surface, a base (134) to which the support pins are fitted, a vertical driving means (Z-direction drive means (138Z)) for elevating and lowering the wafer (W) by vertically driving the support pins through the base, and a horizontal drive means (X-direction drive means (138X), Y-direction drive means (138Y)) for adjusting the position of the wafer in horizontal directions (X-, Y-directions) by horizontally driving the support pins through the base.

Description

technical field

[0001] The invention relates to a substrate transfer device, a substrate processing device, and a substrate transfer method. Background technique

[0002] Generally, in the manufacturing process of a semiconductor integrated circuit, various processes such as film formation, etching, and heat treatment are repeatedly performed on a substrate to be processed, such as a semiconductor wafer (hereinafter, also referred to as "wafer"), to form a wafer. form an integrated circuit. In addition, predetermined post-processing may be performed on the wafers subjected to the above-mentioned processing processes. Examples of post-processing include processing for cleaning the wafer (such as processing to remove deposits adhering to the wafer, etc.), and processing for measuring processing results (such as film thickness measurement processing, particle measurement processing, etc.).

[0003] Such wafer processing is performed, for example, by a substrate processing app...

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