34results about How to "Correct position offset" patented technology

A pixel clock generating apparatus includes a data offset circuit and a pixel generator. The data offset circuit defines multiple data blocks, each data block consisting of a predetermined number of successive clocks, and produces phase data for each data block. The phase data represents an amount and a direction of phase shift to be carried out for a certain clock in each data block. The pixel generator receives the phase data from the data offset circuit and generates a phase-shifted pixel clock a predetermined number of times in each data block based on the phase data.

A detector detects gamma-rays emitted from inside an imaging region. An acquisition unit acquires a plurality of first projection data sets associated with a plurality of projection angles via the detector. An attenuation-correction unit attenuation-correct the plurality of first projection data sets based on a first CT image associated with the imaging region to generate a plurality of second projection data sets associated with the plurality of projection angles. An index calculation unit calculates an index based on the plurality of second projection data sets. The index is corresponding to a degree of positional offset between the imaging region at the time of acquisition of a plurality of third projection data sets associated with the first CT image and the imaging region at the time of acquisition of the plurality of first projection data sets.

An integrated circuit device includes: a data line driving circuit provided for each of a plurality of data signal supply lines that supplies a multiplexed data signal to a corresponding data signal supply line; an order offset register that stores a first order offset setting value; an order setting circuit that sets the order of driving the first pixel; and an order offset addition circuit corresponding to the data line driving circuit. When the data line driving circuit drives the q-th (q is a natural number less than p) pixel in the r-th (r is a natural number less than p) place in the order, the order offset addition circuit processes addition of an order offset correction value based on the r-th order offset setting value among the first order offset setting value.

A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.

This invention realizes accurate positional offset correction between a plurality of tomograms captured by using a tomography apparatus. The invention is a tomography apparatus which corrects the positional offsets between a plurality of two-dimensional tomograms constituting a three-dimensional tomogram. This apparatus includes a tomogram analysis unit (120) which extracts feature amounts representing the tissue of a measurement target, a tomogram selection unit (140) which selects a standard two-dimensional tomogram from the plurality of two-dimensional tomograms based on the feature amounts, and a tomogram position correction unit (150) which calculates the positional offset amount between the nth two-dimensional tomogram adjacent to the standard two-dimensional tomogram and the (n−1)th two-dimensional tomogram.

A substrate transfer device capable of correcting the displacement of a substrate in a horizontal direction by itself without using a transfer arm. The device comprises support pins (132A to 132C) disposed around a support shaft (114) for a load stage (112), separated from the support shaft (114), and supporting a substrate such as a wafer (W) on its lower surface, a base (134) to which the support pins are fitted, a vertical driving means (Z-direction drive means (138Z)) for elevating and lowering the wafer (W) by vertically driving the support pins through the base, and a horizontal drive means (X-direction drive means (138X), Y-direction drive means (138Y)) for adjusting the position of the wafer in horizontal directions (X-, Y-directions) by horizontally driving the support pins through the base.

An integrated circuit device having a data line driving circuit and a position offset addition circuit that connects position offsets based on position offset setting values, wherein, among first pixel to p-th pixel of a plurality of pixels, a position offset register stores a first position offset setting value corresponding to the first pixel and a p-th position offset setting value corresponding to the p-th pixel among the first pixel to the p-th pixel; among first image data to p-th image data respectively corresponding to the first pixel to the p-th pixel, the position offset addition circuit processes a position offset correction value based on the first position offset setting value to the first image data, and processes a position offset correction value based on the p-th position offset setting value to the p-th image data among the first image data to p-th image data, to correct the position offsets.

The purpose of the present invention is to correct, in a highly accurate manner, positional displacement due to a charging phenomenon. A charged particle beam drawing device (100), provided with: an irradiation amount distribution calculation unit (33) for calculating the irradiation amount distribution of a charged particle beam using a pattern density distribution and dose distribution; a fogging charged particle amount distribution calculation unit (34) for convolution-integrating each of the irradiation amount distribution and the respective distribution function for a plurality of fogging charged particles, and thereby calculating a plurality of fogging charged particle amount distributions; a charge amount distribution calculation unit (35) for calculating the charge amount distribution due to direct charging using the pattern density distribution, the dose distribution, and the irradiation amount distribution, and calculating the charge amount distribution due to a plurality of fogging charges using the plurality of fogging charged particle amount distributions; a positional displacement amount calculation unit (38) for calculating the positional displacement amount of the drawing position on the basis of the charge amount distribution due to direct charging and the charge amount distribution due to the plurality of fogging charges; a correction unit (42) for correcting the irradiation position using the positional displacement amount; and a drawing unit (150) for irradiating the corrected irradiation position with a charged particle beam.

A projection type display apparatus in which an inclination and a positional deviation of optical axes among a plurality of light sources can be easily corrected to obtain a high quality projection image. Green, blue and red laser beams emitted from light sources are converted into collimated beams by condenser lenses, and the positions and angles of the optical axes of the beams of the three colors are evaluated by position detection imaging device and angle detection imaging device, respectively. The positions and angles of the light sources are adjusted by respective actuators so that the positions and angles of the optical axes match each other. Consequently, the laser beams emitted from the light sources can be combined with high accuracy to thereby realize a high definition projection type display apparatus.

The invention discloses a fast wall compensation method suitable for MIMO through-wall radar imaging, which comprises the following steps: setting the radar to establish a coordinate system, and specifying pixel points; the MIMO through-wall radar performs multi-transmit and multi-receive real-aperture face-on detection to obtain echoes Signal; find the upper end and lower end corresponding to the first pixel point to calculate the abscissa, calculate the propagation delay value of the first pixel point corresponding to all the transceiver channels, and finally get the propagation delay value of all the pixel points corresponding to all the transceiver channels; combined with the echo signal and propagation delay values ​​according to backprojection imaging to form the final image. The present invention avoids the problem of excessive computational load caused by iteration and traversal in the traditional wall compensation method, and at the same time has the good characteristics of correcting the position deviation of the target image and having a large focused imaging area, and the finally obtained output image can be used for positioning , identifying and extracting targets, and has a good application prospect in MIMO through-wall radar imaging applications that require real-time processing.

A method and an arrangement for manufacturing a multi-layer composite (13) by laminating a sheet-like element (6) onto a backing (2) in a laminating unit (1), having steps, in this order, of conveying the element (6) in a longitudinal direction, detecting a position of the element (6), correcting the position of the element (6) on the basis of the detected position and on the basis of a reference position (15), and bonding said element (6) onto the backing (2). The detection step comprises the phases of measuring the lateral position, an angle of pivoting, and a longitudinal position of the element (6), and the correction step includes phases of lateral movement (T), pivoting (P), and longitudinal movement (L) of the element (6), apparatus elements perform the steps.

A decal transferring method which, when a molded article has a pattern misalignedly transferred thereto, is capable of automatically correcting the misalignment such that the molded article has such pattern transferred thereto at a predetermined position. In the case where there is misalignment of the pattern in a molded article, the misalignment dimension and misalignment direction of the pattern (21) in the molded article (b) are detected as digital values, and a decal transfer film (20) is automatically moved by an amount corresponding to the detected misalignment dimension in a direction opposite to the detected misalignment direction so as to correct the position, whereupon the pattern (21) is transferred to the predetermined position on the transfer-molded article (b).