Electronic device and method for manufacturing electronic device
A technology of electronic devices and frame components, applied in radiation control devices, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of difficult to peel off the flat plate part 911a, difficult to increase the space area of adhesion, etc., to improve reliability and reduce pollution effect
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no. 1 example
[0033]FIG. 1A is a perspective view showing an electronic device in a first embodiment, and FIG. 1B is a cross-sectional view taken along line I-I' in FIG. 1A.
[0034] As shown in FIG. 1B , the electronic device 108 includes: a light receiving element 101; a frame member 102 made of a first resin and provided so as to surround a light receiving element 101; The second resin is formed and fills the periphery of the frame member 102 . Although not shown in FIG. 1B , electronic device 108 further includes a protective film covering a plane formed by the upper surface of frame member 102 and the upper surface of encapsulation resin layer 106 . Also, the light receiving element 101 is electrically coupled to the lead frame 104 through the metal filament 105 .
[0035] The upper surface of the frame member 102 and the upper surface of the encapsulation resin layer 106 form a common plane. More specifically, since the upper surface of the frame member 102 and the upper surface of ...
no. 2 example
[0065] 7A to 7C are sectional views showing the manufacturing process of the electronic device of the second embodiment. The first embodiment is configured to employ the protective tape 107 , whereas the present embodiment is configured to employ the protective glass 207 . Other configurations of this embodiment are similar to those used in the first embodiment.
[0066] The cover glass 207 is formed on a plane jointly formed by the upper surface of the frame member 102 and the upper surface of the encapsulation resin layer 106 . Optically clear glass may be used as the protective glass 207 .
[0067] In the process of manufacturing the electronic device 208 with this configuration, the Figure 4B Similar manufacturing process operations are used to manufacture the electronic device 108 shown in the previous embodiments. Here, manufacturing process operations subsequent to the operation shown in FIG. 2B will be described.
[0068] First, as shown in FIG. 7A , a cover glass...
no. 3 example
[0072] 8A to 8D are sectional views showing a process for manufacturing the electronic device of the third embodiment. The configuration of the electronic device in the third embodiment is similar to that of the electronic device 108 in the first embodiment.
[0073] The frame member 302 of the electronic device in the third embodiment is formed through the manufacturing process shown in FIGS. 8A to 8D . Other manufacturing process operations of this embodiment are similar to those of the first embodiment. 8A to 8D correspond to FIGS. 2A to 2D , respectively. Other manufacturing process operations are similar to those in the first embodiment, and therefore, detailed description thereof will not be repeated.
[0074] First, as shown in FIG. 8A , a wafer 101 a in which a plurality of light receiving elements 101 are formed is prepared. The light receiver unit 101b is exposed to the surface of each light receiving element 101 arranged in the wafer 101a. Here, among the plural...
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