Unlock instant, AI-driven research and patent intelligence for your innovation.

Surface treating method of electronic apparatus shell

A surface treatment and electronic device technology, applied in the surface treatment field of electronic device casings, can solve problems such as poor market competitiveness, decreased antenna reception signal efficiency, inability to reach aluminum or aluminum alloys, etc. quality effect

Inactive Publication Date: 2009-02-04
徐钲鉴
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide a surface treatment method for the shell of an electronic device, which solves the problem that the common method cannot achieve the thin film of aluminum or aluminum alloy on the plastic shell, and can only produce a monotonous metallic texture on the plastic material, which cannot meet the needs of consumers. The needs of consumers, poor market competitiveness, and the formation of a shielding effect on the flat panel antenna, resulting in a decrease in the efficiency of the antenna receiving signals, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface treating method of electronic apparatus shell
  • Surface treating method of electronic apparatus shell
  • Surface treating method of electronic apparatus shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] as attached figure 1 To attach Figure 4 As shown, the surface treatment method of the electronic device casing of the present invention is carried out according to the following steps:

[0025] 10. Carry out sputtering treatment on the surface of substrate A;

[0026] 11. A sputtered layer B is formed on the surface of the substrate A;

[0027] 12. Carry out electrodeposition treatment to the sputtered layer B;

[0028] 13. Generating a dyed area C on the sputtered layer B.

[0029] When the above steps are carried out, first, the sputtering treatment is performed on the surface of the substrate A, and the substrate A after the sputtering treatment will form a sputtering layer B with a metallic texture and a metal effect on the surface of the substrate A. In the process, the sputtering surface material B1 of the sputtering layer B can be conductive metal material or non-conductive metal material; Create stained area C.

[0030] In the sputtering treatment in the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a surface treatment method of an electronic device outer shell, which belongs to the electromechanic field. The method comprises the following steps: (a) a sputtering layer is produced on the surface of a transparent substrate through sputtering; (b) dyeing areas are produced on the sputtering layer through flocking. The method has the advantages that the surface of the transparent substrate has the metal feel of thin film; the sputtering layer on the surface of the substrate does not interfere with the transmission of the wireless signal, which keeps good communication quality; apart from having metal feel and metal effect through the sputtering layer, the substrate can also produce patterns and aesthetics in different colors through the dyeing areas, so as to produce different effect on the sputtering layer and prevent the cold negative impression of the metal effect on people.

Description

technical field [0001] The invention relates to electromechanical products, in particular to a surface treatment method for an electronic device casing. Background technique [0002] As we all know, for the purpose of light weight and convenient manufacturing, most of the casings of electronic devices are made of plastic or plastic materials, but the casings made of plastic materials have poor visual or touching effects and textures. To make the plastic casing of the electronic device have a good visual aesthetic and texture, a metal layer is produced on the plastic casing by plastic electroplating, and a metal layer is produced on the surface of the plastic casing by plastic electroplating, such as the United States Disclosed in Patent 6,045,866. [0003] However, the metal layer plated by the plastic electroplating method can only be less active metals such as copper and nickel, and it is more difficult to use more active metals such as aluminum on the plastic electroplat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C28/00C23C14/34C25D11/22
Inventor 徐钲鉴
Owner 徐钲鉴