Surface treating method of electronic apparatus shell
A surface treatment and electronic device technology, applied in the surface treatment field of electronic device casings, can solve problems such as poor market competitiveness, decreased antenna reception signal efficiency, inability to reach aluminum or aluminum alloys, etc. quality effect
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[0024] as attached figure 1 To attach Figure 4 As shown, the surface treatment method of the electronic device casing of the present invention is carried out according to the following steps:
[0025] 10. Carry out sputtering treatment on the surface of substrate A;
[0026] 11. A sputtered layer B is formed on the surface of the substrate A;
[0027] 12. Carry out electrodeposition treatment to the sputtered layer B;
[0028] 13. Generating a dyed area C on the sputtered layer B.
[0029] When the above steps are carried out, first, the sputtering treatment is performed on the surface of the substrate A, and the substrate A after the sputtering treatment will form a sputtering layer B with a metallic texture and a metal effect on the surface of the substrate A. In the process, the sputtering surface material B1 of the sputtering layer B can be conductive metal material or non-conductive metal material; Create stained area C.
[0030] In the sputtering treatment in the ...
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