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Surface treating method of electronic apparatus shell

A processing method and electronic device technology, applied in the electromechanical field, can solve problems such as poor market competitiveness, decreased antenna receiving signal efficiency, thin film, etc., to achieve the effect of eliminating cold negative impressions and good communication quality

Inactive Publication Date: 2009-02-04
徐钲鉴
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide a method for treating the surface of the housing of an electronic device, which solves the problem that the common method cannot achieve the thinning of aluminum or aluminum alloy on the plastic housing, and can only produce a monotonous metallic texture on the plastic material, which cannot satisfy Consumer demand, poor market competitiveness, and the formation of a shielding effect on the flat-panel antenna, resulting in a decrease in the antenna's signal reception efficiency and other issues

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  • Surface treating method of electronic apparatus shell
  • Surface treating method of electronic apparatus shell
  • Surface treating method of electronic apparatus shell

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Embodiment Construction

[0026] as attached figure 1 to attach image 3 As shown, the surface treatment method of the electronic device housing of the present invention is carried out according to the following steps:

[0027] 10. Carry out sputtering treatment on the surface of substrate A;

[0028] 11. A sputtered layer B is formed on the surface of the substrate A;

[0029] 12. Carry out anodic treatment to the sputtered layer B;

[0030] When the above steps are carried out, first, the sputtering treatment is performed on the surface of the substrate A, and the substrate A after the sputtering treatment will form a sputtering layer B with a metallic texture and a metal effect on the surface of the substrate A. During the process, the sputtering surface material of the sputtering layer B can be conductive metal material or non-conductive metal material.

[0031] In the sputtering treatment in the above steps 10 and 11, the sputtering treatment can be related sputtering treatment such as vacuum ...

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Abstract

The invention relates to a surface treatment method of an electronic device outer shell, which belongs to the electromechanic field. The method comprises the following steps: (a) a sputtering layer is produced on the surface of a transparent substrate through sputtering; (b) the sputtering layer receives anode treatment. The method has the advantages that the surface of the transparent substrate has the metal feel of thin film; the sputtering layer on the surface of the substrate does not interfere with the transmission of the wireless signal, which keeps good communication quality; apart from having metal feel and metal effect through the sputtering layer, the substrate can also produce patterns and aesthetics in different colors through the dyeing areas, so as to produce different effect on the sputtering layer and prevent the cold negative impression of the metal effect on people.

Description

technical field [0001] The invention relates to electromechanical products, in particular to a treatment method for the surface of an electronic device casing. Background technique [0002] As we all know, for the purpose of light weight and convenient manufacturing, most of the casings of electronic devices are made of plastic or plastic materials, but the casings made of plastic materials have poor visual or touching effects and textures. To make the plastic casing of the electronic device have a good visual aesthetic and texture, a metal layer is produced on the plastic casing by plastic electroplating, and a metal layer is produced on the surface of the plastic casing by plastic electroplating, such as the United States Disclosed in Patent 6,045,866. [0003] However, the metal layer plated by the plastic electroplating method can only be less active metals such as copper and nickel, and it is more difficult to use more active metals such as aluminum on the plastic elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C23C14/34C25D11/02
Inventor 徐钲鉴
Owner 徐钲鉴