Surface treating method of electronic apparatus shell
A processing method and electronic device technology, applied in the electromechanical field, can solve problems such as poor market competitiveness, decreased antenna receiving signal efficiency, thin film, etc., to achieve the effect of eliminating cold negative impressions and good communication quality
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[0026] as attached figure 1 to attach image 3 As shown, the surface treatment method of the electronic device housing of the present invention is carried out according to the following steps:
[0027] 10. Carry out sputtering treatment on the surface of substrate A;
[0028] 11. A sputtered layer B is formed on the surface of the substrate A;
[0029] 12. Carry out anodic treatment to the sputtered layer B;
[0030] When the above steps are carried out, first, the sputtering treatment is performed on the surface of the substrate A, and the substrate A after the sputtering treatment will form a sputtering layer B with a metallic texture and a metal effect on the surface of the substrate A. During the process, the sputtering surface material of the sputtering layer B can be conductive metal material or non-conductive metal material.
[0031] In the sputtering treatment in the above steps 10 and 11, the sputtering treatment can be related sputtering treatment such as vacuum ...
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