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A pad clamp

A clamp and liner technology, applied in the field of large-scale integrated circuit manufacturing equipment, can solve the problems that the surface oxide layer is easily crushed and damaged, so as to reduce adverse effects, improve the rate of qualified products, and improve the rate of excellent products. Effect

Active Publication Date: 2011-12-14
HEJIAN TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on the protection effect of the aforementioned A101 type liner deposition reaction chamber for this type of crush damage, it is better than the standard type liner deposition reaction chamber. Therefore, the present invention provides a liner clamp aimed at solving The technical problem that the oxide layer on the surface of the wafer processed in the pad deposition reaction chamber is easily crushed and damaged during the process of depositing the AL conductive layer

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Embodiment Construction

[0017] The technical solutions of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which typical embodiments of the invention are shown. However, this invention can be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. On the contrary, providing these embodiments can enable the technical solutions of the present invention to more fully convey the protection scope of the present invention to those skilled in the art.

[0018] Such as figure 1 and figure 2 Shown is the process of improving the deposition liner clamp 1 of the present invention on the basis of the previous defects. From figure 1 It can be seen from the structural schematic diagram of an existing standard type liner clamp that when the wafer (wafer) 6 deposits a Ti / TiN composite liner in a standard type liner deposition reaction chamber, the wafer (wafer) The 6 edge surface is completely pr...

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Abstract

The invention relates to a standard liner clamp for depositing a Ti / TiN composite liner in the process of wafer manufacturing process. Positioning and fixing holes are arranged on the clamp body. The AL deposition tongs press against the corresponding positions of the 6 PAD probes on the wafer to form 6 shallow pincer grooves. In this way, when the wafer is deposited with a composite liner in a standard liner deposition chamber, the cut part can also be deposited on the Ti / TiN composite layer, thereby making it possible to effectively deposit the Al conductive layer. Protects the edge of the wafer from oxide damage caused by the top pressure of the 6 PAD probes of the AL deposition clamp.

Description

technical field [0001] The invention relates to a large-scale integrated circuit manufacturing equipment, in particular to a standard pad clamp for depositing a Ti / TiN composite pad during the wafer manufacturing process. Background technique [0002] With the rapid development of integrated circuit technology, the integration level is constantly increasing, and the chip area is constantly shrinking, which provides the possibility for more and more extensive and superior applications. What is particularly prominent is that with the further deepening of research, more and more process equipment has been developed and designed, making the manufacturing process of integrated circuits have achieved a nanoscale leap. A set of semiconductor manufacturing equipment usually needs to perform hundreds of processing operations on the wafer. During the operation, it is necessary to use some necessary equipment to clamp the wafer to improve the stability of the operation. In general, th...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687C23C14/50C23C16/458
Inventor 李文涛
Owner HEJIAN TECH SUZHOU