Apparatus for dynamically configuring chip pin function

Abstract

The invention provides a device of dynamically configuring chip pin functions, comprising a pin input control unit which processes the input pin of the chip, integrates a plurality of different pins and selects each pin function according to a program; a pin output control unit which outputs a control signal to a plurality of pins and selects the output signal value of each pin according to the program with the pre-arranged output pin functions appointed by the user; and a signal control unit which carries out the control by using the program, is connected with the pin input control unit and the pin output control unit and used for communicating and processing the signals of the pin input control unit and the pin output control unit.

Description

technical field [0001] The invention relates to a device for dynamically configuring the functions of chip pins, in particular to a device for providing users with the functions of specifying package pins. Background technique [0002] Due to the continuous advancement of process technology, the micron (μm) process has entered the nanometer (nm) process, so the number of transistors on a unit wafer has increased exponentially, which means that more circuits can be accommodated under the same area, but more circuits usually It means that there are more communication interfaces with the outside of the chip, so the same packaging (Packaging) contains more pins, and the demand trend of packaging in the future will become more and more obvious. [0003] On the other hand, as far as the production of integrated circuit packaging is concerned, the number of package pins is almost equal to the increase or decrease of production cost. If only the functional pins that need to be used ...

AI Technical Summary

Problems solved by technology

This technology can determine which pins on the package correspond to which functions without changing the chip circuit. The disadvantage is that this method is not very flexible, and it must use a wire bonding machine to achieve the changes required by the user. , the cost is high, and when the distance of wire bonding is too far, there will also be a problem of low pass rate

Furthermore, after the integrated circuit (Integrated Circuit, IC) has been packaged, the function of each pin cannot be changed, because the internal circuit of the integrated circuit and the bonding wires have been fixed, and the pin function cannot be further changed.

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