Preparation method for soft and hard composite boards
A technology of soft and hard composite boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., and can solve the problems of reduced production rate, difficulty in accurately controlling cutting depth, time and money loss, etc.
Inactive Publication Date: 2009-03-04
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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Problems solved by technology
[0004] However, the method of removing redundant hard boards by using mechanical contour processing technology, especially when cutting a hard board with a predetermined depth at the junction of soft and hard boards, has the difficulty of accurately controlling the cutting depth and the risk of damage to the soft board , and most of the appearance processing technologies that remove the process require the use of more expensive jigs or tools, resulting in a substantial increase in costs during small-scale and diverse production. In addition, the design and production of jigs or molds will cause time and money loss, resulting in The production rate is reduced and the total cost is increased. Therefore, this technical field still needs an improved manufacturing process of soft and rigid composite boards to improve the shortcomings of the prior art.
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[0027] In order to make the above objects, features and advantages of the present invention more clearly understood, preferred embodiments are listed below and described in detail with the accompanying drawings. However, the following preferred embodiments and accompanying drawings are only for reference and description, and are not intended to limit the present invention.
[0028] see Figure 1 to Figure 7 , which shows a schematic diagram of the manufacturing method of the soft-hard composite board according to the preferred embodiment of the present invention.
[0029] like figure 1 As shown, a flexible board 10 is first provided, which includes an intermediate base layer 12 , a copper circuit pattern layer 22 and a copper circuit pattern layer 32 . The intermediate base layer 12 may be formed of a dielectric material, and the material of the dielectric material may be polyimide resin, polyester, or liquid crystal polymer, but not limited thereto.
[0030] Next, a protec...
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The invention provides a preparation method of an improved soft-hard composite plate, in particular to a method for improving the removing way of a residual hard plate right above the bending area of a prearranged soft plate. The method is mainly characterized in that after all layers of hard plate circuits are completed, a groove is etched at the intersection of the hard plate and the bending area of the prearranged bending area by a laser; subsequently, mechanical forming is carried out; subsequently, a copper-etching method is used to etch a copper foil layer at the bottom of the groove; and finally, the residual hard plate right above the bending area of the prearranged soft plate is removed.
Description
technical field [0001] The present invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a rigid-flex circuit board. Background technique [0002] Soft-hard composite circuit boards (hereinafter referred to as soft-hard composite boards) have been widely used in mobile communication, medical, industrial instruments and consumer electronic products due to their flexible and foldable characteristics. [0003] As known to those who are familiar with this technology, the production of flexible and rigid composite boards usually takes a flexible circuit board (hereinafter referred to as a flexible board) as the core, and then uses a rigid multilayer circuit board (hereinafter referred to as a rigid board) process, such as The build-up method, or the core lamination method, forms one or more layers of circuits on the flexible board. Finally, the excess hard board above the predetermined flexible board bending area needs to...
Claims
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Inventor 蔡宗委林宇伦许宏恩
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION