Semiconductor chip pickup apparatus and pickup method

Abstract

The invention relates to a semiconductor die pick-up device and a pick-up method, providing a wiper (33) that has a tip end (33b) moving in and out of an adherence surface (22) and a shutter (23) that is moved with the wiper while blocking an opening (41) located on moving direction of the wiper. When picking up a semiconductor die (15), the tip end of the wiper is aligned with one end (15a) of the semiconductor die; the wiper (33) is moved along the adherence surface (22) while the tip end of the wiper is protruded from the adherence surface with the semiconductor die being suction-held by a collet (18); a suction opening (42) is sequentially opened between an end surface (41a) of the opening (41) and a sheet surface (33a); a dicing sheet (12) is sequentially sucked from one end (15a) of the semiconductor die (15) at the suction opening and is sequentially peeled from the semiconductor die (15). In the pick-up device of the semiconductor die, effects of inhibiting the power exerted onto a semiconductor die when peeling a dicing sheet and of easily picking up a semiconductor die are provided.

Description

technical field [0001] The present invention relates to a structure and a pick-up method of a semiconductor chip (die) pick-up device. Background technique [0002] Semiconductor chips are manufactured by cutting a 6-inch or 8-inch wafer into a predetermined size. When dicing, in order to prevent the diced semiconductor chips from being messed up, an adhesive holding sheet is attached to the back surface, and the wafer is cut from the front side with a cutting blade or the like. At this time, the holding sheet attached to the back surface is not cut, although it is slightly cut, and each semiconductor chip is held. Then, the cut semiconductor chips are picked up from the holding sheet one by one, and sent to the next process such as die bonding. [0003] In the past, as a method of picking up a semiconductor chip from an adhesive holding sheet, the method of protruding pins is mostly used (for example, referring to Patent Document 1 Figure 15 ). This method is to use a c...

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Problems solved by technology

[0004] However, there is the following problem in this method of protruding the ejector pin: if the thickness of the semiconductor chip becomes thinner, the problem of cracking the semiconductor chip due to the top will occur, and it is very difficult to pick up the thin semiconductor chip in recent years.

Especially in recent years, semiconductor chips are thin and have low strength, so cracks or deformation may occur due to such force

In this way, the method described in Patent Document 1 has the following problems: if a large suction hole is used, a large force is applied to the semiconductor chip during suction, and if a small suction hole is used, a large force is applied to the semiconductor chip when the base moves Larger force, therefore, the force applied to the semiconductor chip cannot be reduced when the holding sheet is peeled off, which can cause damage to the semiconductor chip

Therefore, if the suction hole is blocked by the peeled holding sheet due to the movement of the protrusion, the amount of air suction will gradually decrease, the degree of vacuum between the protrusion and the holding sheet will decrease, and the peeling force will gradually decrease.

In addition, on the side of the end face of the semiconductor chip toward the movement direction of the protruding part, the peeling residue of the holding sheet occurs, and the semiconductor chip cannot be picked up smoothly.

In this case, although the protruding height of the protruding portion can be increased, the peeling force of the holding sheet can be increased by utilizing the pulling force acting on the holding sheet, but, if there is a semiconductor chip adjacent to the moving direction of the protruding portion, sometimes The protruding portion collides with the semiconductor chip and damages the semiconductor chip, so the moving direction of the protruding portion is restricted

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