Manipulator for fetching and delivering silicon chip

A manipulator and silicon wafer technology, applied in the field of manipulators, can solve the problems of large volume, complex structure, secondary pollution, etc., and achieve the effects of small size, reduced mechanical friction, and low cost

Active Publication Date: 2009-03-11
陈百捷 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Now the most used is the manipulator in the form of a three-fold arm. This type of manipulator adopts a multi-joint structure such as a main arm, an auxiliary arm, and a wrist.

Method used

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  • Manipulator for fetching and delivering silicon chip
  • Manipulator for fetching and delivering silicon chip
  • Manipulator for fetching and delivering silicon chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The present invention will be described in detail below with reference to the drawings and embodiments.

[0016] Such as figure 1 As shown, the present invention includes a horizontal drive mechanism 1, a vertical drive mechanism 2, a rotary drive mechanism 3 and a frame (not shown in the figure) on which the above three drive mechanisms 1, 2, and 3 are installed.

[0017] The horizontal drive mechanism 1 of the present invention includes a horizontal drive motor 11 installed on the frame. The output end of the horizontal drive motor 11 is connected to a driving gear wheel 12, and the driving gear wheel 12 is connected to the driven gear through a toothed belt 13. Toothed wheel 14, one side of the toothed belt 13 is fixedly connected to a bracket 15. The bracket 15 is simultaneously pierced on two horizontal light bars 16 arranged in parallel up and down. The bracket 15 is driven by the toothed belt 13, The horizontal movement can be performed along the two horizontal ligh...

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PUM

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Abstract

The invention relates to a mechanical arm which is used for transporting silicon chips. The invention is characterized in that the mechanical arm comprises a horizontal driving mechanism, a vertical driving mechanism, a rotationally driving mechanism and a frame which is used for installing the three driving mechanisms, wherein the horizontal driving mechanism comprises a horizontal driving motor connected with a bracket which can horizontally move along two horizontal feeding rods through a first transmission device; the vertical driving mechanism comprises a vertical driving motor which is connected to the bracket, and the vertical driving motor is connected with a lifting frame which moves along two vertical feeding rods from top to bottom through a second transmission device; and the rotationally driving mechanism comprises a rotationally driving motor which is connected to the lifting frame and is connected with a main arm through a third transmission device, the top of the main arm perforates through the top of the bracket and is connected with a paw, the upper surface of the paw is provided with a sucking disk, and a vacuum air channel which is communicated with the sucking disk is arranged in the center of the main arm and the paw. The invention has simple structure, small volume and low cost, and can be widely used for a transporting process of various silicon chips.

Description

Technical field [0001] The invention relates to a manipulator, in particular to a manipulator for taking and delivering silicon wafers. Background technique [0002] At present, in the semiconductor manufacturing industry, because silicon wafers are expensive and the cleanliness requirements of silicon wafers during the manufacturing process are also very high, extra care must be taken when handling silicon wafers. The most commonly used manipulators in the form of three-fold arms are manipulators with multi-joint structures such as main arms, jibs, and wrists. The structure is complex and large, and mechanical particles are likely to cause secondary pollution to the silicon wafer during movement. . Summary of the invention [0003] In view of the above-mentioned problems, the purpose of the present invention is to provide a small-sized and simple-structured manipulator for handling silicon wafers. [0004] In order to achieve the above objectives, the present invention adopts t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677B65G47/91B25J3/04B25J15/06
Inventor 陈百捷徐伟新姚广军
Owner 陈百捷
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