Chip electro-static discharge test device

Abstract

The invention provides a device for testing the static discharge of a chip. The device comprises a first circuit board and a second circuit board; the upper surface of the first circuit board is provided with pads corresponding to the positions of all pins of the chip to be tested, and the pads are used for electrically connecting each pin of the chip to be tested when welding; the two sides of the first circuit board are provided with a faller A which is electrically connected with the pads in an one-to-one way; the other end of the faller A is electrically connected with a second circuit board, the lower surface of the second circuit board is provided with a faller B corresponding to a testing board of the static discharge testing equipment, the faller A and the faller B are electrically connected in a one-to-one way. By adopting the invention, the testing device suitable for special encapsulated chips can be manufactured according to the testing board in the testing equipment, thus realizing that all measured pins of the chip to be tested are electrically connected with the inside of the testing equipment. The testing device has simple structure and design, low manufacturing cost and short manufacturing period and reduces the cost for carrying out the static discharge test on the special encapsulated chips.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip electrostatic discharge testing device. Background technique [0002] Electrostatic Discharge (ESD, Electrostatic Discharge) is one of the most costly damage causes in the electronics industry. It will affect the production yield, manufacturing cost, product quality and reliability, and the company's profitability. Therefore, it is necessary to conduct ESD tests on IC products to evaluate their ESD protection performance. [0003] At present, domestic ESD tests are generally carried out with standard ESD test equipment, and these test equipment need to place the IC on a test board that matches the package form of the IC when performing ESD testing, so that all the pins to be tested can pass the test The board is electrically connected to the inside of the device. [0004] Usually ESD test equipment will be equipped with several test boards suitable for more commonly...

AI Technical Summary

Problems solved by technology

However, for ICs in special packages, due to their special pin distribution and other issues, ESD equipment does not have a matching test board, which requires a custom-made test board for this type of IC.

And the cycle of custom-made test board is very long, it takes about 6-8 weeks from design to production, and the cost is also very expensive

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