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Evaporation chamber for inner container type evaporative cooling device

An evaporative cooling and evaporation chamber technology, applied in the field of evaporation chambers, can solve problems such as increasing costs

Inactive Publication Date: 2013-03-27
北京博思利码科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Chinese patent CN2824289 discloses a whole-system non-consumable refrigerant gravity cycle evaporative cooling device with switching power supply. The patent lists several structures of the evaporation chamber. Since the refrigerant has a certain pressure, the evaporation chamber must have a certain mechanical strength. In order to ensure thermal contact with semiconductor power devices, the mounting surface needs to be processed to a high degree of smoothness and flatness, which increases the cost

Method used

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  • Evaporation chamber for inner container type evaporative cooling device
  • Evaporation chamber for inner container type evaporative cooling device
  • Evaporation chamber for inner container type evaporative cooling device

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Embodiment Construction

[0016] Figure (1) shows the evaporative chamber structure of a liner-type evaporative cooling device installed with plastic encapsulated semiconductor power devices. In the figure, 1 is the cooled semiconductor power device, 2 is the inner tank made of thin metal plate, copper plate is the best, and 3 is the jacket clamp, which is made of high mechanical strength metal such as steel, stainless steel, etc. 4 is the metal plate that doubles as the electrical output lead, 5 and 6 are also the electrical output lead, 7 is the liquid refrigerant inlet, 8 is the gas refrigerant outlet, and 9 is the fastening bolt. The inner tank 2 is a rectangular sealed cavity. The liquid refrigerant inlet 7 and the gas refrigerant outlet 8 are welded to the bottom and top of the inner tank 2 respectively. The width of the left and right surfaces of the inner tank is larger than the front and rear surfaces, and the smoothness should be improved by polishing and other methods. The heat conducting su...

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Abstract

An evaporation chamber of a liner-type evaporative cooling apparatus is composed of a liner make of metal sheet and an outer reinforced framework. The evaporation chamber is easy to implement sealing and heat transference to the semi-conductor power device; and has easy processing and low cost.

Description

technical field [0001] The invention relates to an evaporation chamber of an evaporative cooling device, in particular to an evaporation chamber of an evaporative cooling device with thin metal plates such as copper and aluminum as the inner liner, and metals such as steel and stainless steel as the outer reinforcement frame. technical background [0002] Chinese patent CN2824289 discloses a full-system non-consumable refrigerant gravity circulation evaporative cooling device with switching power supply. The patent lists several structures of the evaporation chamber. Since the refrigerant has a certain pressure, the evaporation chamber must have a certain mechanical strength. In order to ensure thermal contact with semiconductor power devices, the mounting surface needs to be machined to a high finish and flatness, which increases costs. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to reduce the cost of materials and processing technology under...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/34
Inventor 王玉富
Owner 北京博思利码科技有限公司