Receiving and converying device of workpiece and cutting device with the same
A technology for conveying devices and workpieces, used in electrical components, conveyor objects, transportation and packaging, etc., can solve problems such as increasing lifting amount, large lifting amount, and conveying errors, and achieve reliable tight closing, vibration suppression and Noise, the effect of preventing conveyance errors
Active Publication Date: 2009-04-29
DISCO CORP
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Problems solved by technology
[0014] However, when the ring frame clamped by the clamper is tilted upward (especially when the wafer diameter is large, even if the tilt angle is small, the amount of tilt becomes large), in order to get over the step, The lifting amount needs to be increased, and the ring frame cannot go over the steps with only the pulling up amount of the clamp, resulting in a transfer error
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[0031] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , shows an external perspective view of a cutting device (cutting device) 2 to which the workpiece storing and conveying device of the present invention can be applied.
[0032] Cutting device 2 includes: figure 2 Shown is a first wafer storage section 4 as a first workpiece storage section, a second wafer storage section 6 as a second workpiece storage section, a first wafer transfer member 10, a second wafer transfer member 12, a wafer rail 14, a card Disk table 16 , cutting member 18 and cleaning member 20 .
[0033] The first wafer transport member 10 unloads the wafer from the first wafer storage unit 4 or the second wafer storage unit 6 , and transports the unloaded wafer to the chuck table 16 . Then, the wafer cleaned by the cleaning member 20 is loaded again into the first wafer storage unit 4 or the second wafer storage unit 6 .
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The invention provides a work-piece containing / conveying device and cutter having the same; the work-piece containing / conveying device can reliably prevent the work pieces, as semiconductor chip from protruding from the work-piece containing part; the work-piece containing / conveying device comprises a first work-piece containing part for containing multiple work pieces; a second work-piece containing part arranged at the lower part of the first work-piece containing part; the second work-piece containing part comprises a frame body which has a first conveying inlet at the side of the work-piece conveying component and a second conveying inlet at the side of the operator; a work-piece bearing table which can be pulled out from the second conveying inlet in sliding way. The work-piece bearing table is connected with the frame body via the pulling-out sliding tracks; the bottom of the work-piece bearing table is equipped with a frame location pin applied with an upward force; when the work-piece bearing table is pulled to the predetermined poison in the frame body, the frame location pin and the guide block fixed on the bottom of the frame body are locked, so as to downwards pull the frame location pin to the predetermined poison.
Description
technical field [0001] The present invention relates to a workpiece storage and transfer device for storing workpieces such as semiconductor wafers, and a cutting device provided with the workpiece storage and transfer device. Background technique [0002] A large number of devices such as IC (Integrated Circuit: Integrated Circuit) and LSI (Large Scale Integration: Large Scale Integrated Circuit) are formed on the surface of a semiconductor wafer, and each device is divided by a predetermined dividing line (interval). The semiconductor wafer is processed to a predetermined thickness by grinding the back surface of the semiconductor wafer to a predetermined thickness, and then the planned dividing line is cut by a dicing device (cutting device). Therefore, it is divided into individual devices and used in electrical equipment such as mobile phones and personal computers. [0003] The cutting device includes: a cassette loading mechanism having a cassette loading table on wh...
Claims
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IPC IPC(8): H01L21/677H01L21/301H01L21/78
Inventor 奥鸣研悟野村优树
Owner DISCO CORP