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Thermosetting polyimide resin composition and cured product thereof

A technology of polyimide resin and polyimide, which is applied in the field of thermosetting polyimide resin composition and its cured product, can solve the problems of increased molecular weight, short pot life, difficult operation, etc., and achieve the reduction of solvent amount, The effect of shortening the drying time and rationalizing the operation process

Inactive Publication Date: 2009-04-29
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with aromatic diamines, aliphatic diamines have higher reactivity. When reacting in organic solvents, the molecular weight increases in a short time at low temperature, the reaction liquid solidifies from liquid to solid, and the pot life is short. , Difficult to operate

Method used

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  • Thermosetting polyimide resin composition and cured product thereof
  • Thermosetting polyimide resin composition and cured product thereof
  • Thermosetting polyimide resin composition and cured product thereof

Examples

Experimental program
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preparation example Construction

[0040] In the preparation of ordinary polyimide, tetracarboxylic dianhydride is generally used as the tetracarboxylic acid component of the raw material, but in the present invention, tetracarboxylic acid or tetracarboxylic acid can be used in addition to tetracarboxylic dianhydride. Esters of acids and alcohols. Therefore, since tetracarboxylic acid can be directly used as a raw material in this invention, it is advantageous in terms of production facilities and cost, and a practical polyimide resin composition can be prepared.

[0041] The high heat-resistant thermosetting polyimide resin composition of the present invention and cured product thereof can obtain by comprising the method for following operation (1)-(4):

[0042] Step (1): a step of compounding a tetracarboxylic acid component and an aliphatic diamine and heating and reacting to synthesize polyimide A, wherein the number of moles of the tetracarboxylic acid component is in excess compared to the number of moles...

Embodiment

[0116] The present invention will be described in detail below by way of examples and comparative examples. However, the present invention is not limited to these Examples.

[0117] Measurement of physical properties was carried out by the following methods.

[0118]

[0119] The IR spectrum was obtained using JIR-WINSPEC50 (infrared absorption spectrum) manufactured by JEOL.

[0120]

[0121] With the TV-20 type cone-plate viscometer (cone-plate viscometer) manufactured by TOKIMEC, obtain the thermosetting polyimide resin composition (solvent is N-methyl-2-pyrrolidone) under 25 ℃, solid content concentration is 50wt%. ) solution viscosity.

[0122]

[0123] Using a thermogravimetric analyzer (DTG-50) manufactured by Shimadzu Corporation, under a nitrogen flow, the temperature was raised from room temperature at a temperature increase rate of 10 °C / min, kept at 200 °C for 30 min, and removed from 200 °C. The temperature was raised to 250°C at a rate of 5°C / min. Therea...

Synthetic example 1

[0131]

[0132] In a 500mL four-necked flask with a thermometer, a stirrer, a nitrogen gas introduction tube, a dropping funnel with a side tube, a Dean-Stark trap, and a condenser tube, under a nitrogen atmosphere, add 33.91 grams (0.15 moles) of 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 96.67 grams (0.10 moles) of ethylene oxide propylene oxide copolymer bis(2-aminopropyl) ether (manufactured by Mitsui Chemicals Fain, trade name: Geepha-Min ED900), 85.15 grams of N-methyl-2-pyrrolidone, heated up to 200°C, carried out imidization reaction for 3 hours, and used a Dean-Stark apparatus The resulting water is separated. After 3 hours, it was confirmed that distillation of water had ceased, and 3.60 g of water was recovered to obtain polyimide A1. Confirm the IR spectrum of this polyimide A1, confirm v(C=O) 1766, 1700cm -1 The characteristic absorption of the imide ring confirmed the formation of polyimide.

[0133] Add 20.13 grams (0.10 moles) of 4,4'-diaminodiphenyl ...

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Abstract

Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4). Step (3): A step wherein the polyimide (B) obtained in the step (2) is blended and mixed with a bismaleimide compound represented by the formula (5).

Description

technical field [0001] The present invention relates to a thermosetting polyimide resin composition and its cured product. The thermosetting polyimide resin composition is a one-component curing type, does not cure at room temperature, and has a long pot life, and its cured product has excellent flexibility and does not heat even when heated at 250°C. It is resistant to heat such as decomposition, and has adhesiveness at high temperatures, so it can be used in various industrial products. Background technique [0002] Conventional polyimide resins have been widely used as engineering plastics excellent in heat resistance. Among them, a polyimide resin obtained by reacting a bismaleimide compound and an aromatic diamine as raw materials is widely used as a thermosetting polyimide resin for electrical insulating materials and the like. [0003] As this bismaleimide compound and aromatic diamine as the preparation method of the thermosetting polyimide resin of raw material, d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08K5/3415
CPCC08K5/3415C08G73/1028C08G73/12C08G73/1007C08L79/08C08G73/10
Inventor 大城户正仁上野航大石实雄木原秀太
Owner MITSUBISHI GAS CHEM CO INC
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