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Module

A technology of modular units and substrates, applied in door/window accessories, electrical components, wing components, etc., can solve the problems of increased total thickness, cannot be used for miniaturization and highly integrated electronic equipment, etc., to achieve the effect of improving integration

Inactive Publication Date: 2009-04-29
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the upper package 20 and the lower part 10 are stacked on each other, the total thickness increases
Therefore, this structure cannot be used in electronic devices pursuing miniaturization and high integration

Method used

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Examples

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Embodiment Construction

[0022] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the invention idea.

[0023] The following will refer to figure 2 to FIG. 4 describe a module according to a first embodiment.

[0024] In the description of the embodiment, when an element is said to be formed on or under another element, the first element may be directly formed on or under the second element such that the two elements are in contact, or the first element may be formed indirectly A third element is interposed between the first element and the second element on the second element.

[0025] In the drawings, the thic...

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PUM

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Abstract

A module is provided. The module includes a first module unit provided at a top surface with a cavity and a second module unit on which one or more electronic devices are mounted. The second module unit is at least partly received in the cavity of the first module unit.

Description

technical field [0001] Embodiments of the invention relate to modules. Background technique [0002] Recently, various packages such as ball grid array packages (BGA) and system-in-packages have been proposed to keep up with the development needs of miniaturization and high integration of semiconductor packaging systems for realizing electronic equipment modules. [0003] figure 1 is a view of a semiconductor package manufactured by applying a package-on-package technique of related art. [0004] Such as figure 1 As shown in , an upper package 20 is stacked on the lower package 10 by which the upper package 20 is physically and electrically connected to the lower package 20 . [0005] However, since the upper package 20 and the lower part 10 are stacked on each other, the total thickness increases. Therefore, this structure cannot be used in electronic devices pursuing miniaturization and high integration. Contents of the invention [0006] technical problem [0007]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
CPCH01L2924/15311H01L2924/19105H01L2224/32145H01L25/162H01L2225/107H01L23/13H01L2924/19041H01L24/48H01L2224/48091H01L25/105H01L25/16H01L2224/48227H01L2924/00014H01L2924/1627H01L2924/181Y10T29/49002H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207E05Y2600/62E05Y2600/632E05Y2900/132E06B1/56E06B5/16
Inventor 孙炅楱
Owner LG INNOTEK CO LTD