Laser processing method and laser processing apparatus

Abstract

The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. A laser processing apparatus is provided with first and second laser oscillators (2a, 2b) for emitting laser beams (3a, 3b) of which at least the wavelength or the intensities are different from each other; a stage apparatus (5) for moving a workpiece (1) to be processed; and optical systems (4a, 4b) for guiding the laser beams (3a, 3b) to prescribed positions of the workpiece (1). The optical systems (4a, 4b) can be moved by means of an adjusting device (6) according to the relative moving direction of the laser beams (3a, 3b) and the workpiece (1) to permit the prescribed position of the workpiece (1) to be irradiated with laser beams (3a, 3b) in that order so that the workpiece (1) can be processed by the laser beams (3a, 3b). Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.

Description

technical field [0001] The present invention relates to a method of processing a workpiece using a laser beam, and a device using the method. Background technique [0002] In the past, when using laser beam radiation to cut or weld workpieces, or to remove, for example, only a specific layer from the surface of a workpiece, laser beams with different intensities and wavelengths were sometimes irradiated in multiple stages for, for example, preheating and main processing , or remove the first layer and remove the second layer. [0003] For example, Patent Document 1 discloses a technique for improving the processing efficiency in this case, which uses a row of laser oscillators, the number of which is as many as the number of layers to be processed, and each laser oscillator emits only for a specific layer effective laser beam. [0004] Patent Document 1: Japanese Patent Application Publication No. H08-10970. [0005] In addition, in the technique disclosed in Patent Docum...

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Problems solved by technology

[0009] First, in the technology of Patent Document 1, the number of laser oscillators is the same as the number of layers to be processed, so the radiation of the board or the laser beam must move an extra distance in the X direction and the Y direction, resulting in low processing efficiency and productivity. low problem

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