Electronic packaging device and preparation method thereof

An electronic packaging and device technology is applied in the field of complex-shaped electronic packaging devices and their preparation. Heat dissipation, good thermophysical and mechanical properties, low cost effect

Inactive Publication Date: 2009-05-20
有研科技集团有限公司
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although Cu and Al have high thermal conductivity, they have large thermal expansion coefficients; Wo/Cu and Mo/Cu have high densities, which are not suitable for the current lightweight requirements of electronic equipment; metal matrix composites have become popular in recent years because of their thermal expansion coefficients. It is a hotspot

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic packaging device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Example 1:

[0039] The mass ratio of raw materials: binder components is: paraffin: polyethylene: stearic acid=7:2.5:1.5, and the volume ratio of SiC particles with a particle size of 14 μm to the binder is 60:40.

[0040] Take 4Kg of the raw material powder in the above ratio and press it with a double-roller plastic mixing machine figure 1The process shown is extruded and mixed, the mixing temperature is 150℃, and the mixing time is 30min. After the mixing is evenly mixed, it is ground into a fine particle powder with a ball mill, and then the mixed powder is injection molded into the required part shape by an injection molding machine. The injection pressure It is 155MPa, the injection temperature is 160°C, and the injection speed is 50%. The obtained blanks are first degreased in organic solvent for 15 hours, and then thermally degreasing. The thermal degreasing process is as follows: heat at a certain heating rate to 250℃ and keep it for 20 minutes, and at a certain h...

Example Embodiment

[0041] Example 2:

[0042] The mass ratio of raw materials: binder components is: paraffin: polyethylene: stearic acid=6:3:2, and the volume ratio of SiC particles with a particle size of 28 μm to the binder is 65:35.

[0043] Take 4Kg of the raw material powder in the above ratio, extrude and mix with a double-roller plastic mixer, mix at a temperature of 150°C, and mix for 30 minutes. After mixing, use a ball mill to grind into fine particles. Then, the mixed powder is injected Machine injection molding is the required part shape, the injection pressure is 165MPa, the injection temperature is 160°C, and the injection speed is 50%. The obtained blanks are first degreased in organic solvent for 18 hours, and then thermally degreasing. The thermal degreasing process is as follows: heat at a certain heating rate to 250°C for 20 minutes, heat at a certain heating rate to 400°C for 20 minutes, and finally Heat up at a certain rate to the predetermined sintering temperature of 1000°C a...

Example Embodiment

[0044] Example 3:

[0045] The mass ratio of raw materials: binder components is: paraffin: polyethylene: stearic acid = 7:3:1, and the volume ratio of SiC particles with a particle size of 20 μm to the binder is 70:30.

[0046] Take 4Kg of the raw material powder in the above ratio, extrude and mix with a double-roller plastic mixer, mix at 160℃, mix for 45min, mix evenly, grind it into fine particle powder with a ball mill, and then inject the mixed powder Machine injection molding is the required part shape, the injection pressure is 175MPa, the injection temperature is 180°C, and the injection speed is 55%. The obtained blanks are first degreased in organic solvent for 20 hours, and then thermally degreasing. The thermal degreasing process is as follows: heat up to 300℃ at a certain heating rate and hold for 30 minutes, and heat up to 400℃ at a certain heating rate for 30 minutes, and finally The temperature is increased to a predetermined sintering temperature of 1100°C and t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention relates to an electronic package device and a preparation method thereof. The electronic package device is characterized in that the electronic package device has a composite type structure and comprises a main body and one or more pre-embedded bodies. The prepared electronic package device has designable performance, obtains different performances through adjusting the body and the pre-embedded bodies, and has wide application prospect in the field of high-power package, semiconductor illumination (LED) and military affairs.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic packaging devices, and in particular provides a complex-shaped electronic packaging device with high density, high thermal conductivity, low expansion coefficient and composite structure prepared by powder injection molding / pressure immersion technology and a preparation method thereof . Background technique [0002] In response to the continuous increase in electronic packaging density and heat generation density, electronic packaging materials and devices for heat dissipation packaging must not only have good thermal conductivity to quickly conduct heat generated by electronic components, but also need to be compatible with semiconductor components and packaging substrate materials. The coefficient of thermal expansion to avoid failure of electronic components or soldering due to thermal stress. In addition, it will be a key technology for packaging devices in the future to de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/31H01L23/29H01L21/56C09K3/10
Inventor 尹法章郭宏石力开张习敏徐骏
Owner 有研科技集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap