Lead frame of pinless encapsulation

Abstract

The invention discloses a lead frame for lead-free package, which comprises a plurality of packaging areas, a plurality of clearances, a plurality of connecting parts, a plurality of openings and an adhesive tape. Each packaging area comprises a plurality of packaging units, and each packaging unit comprises a chip holder and a plurality of pins around the chip holder; and the plurality of the clearances are arranged around each packaging unit. The plurality of the connecting parts is connected with each packaging area. The plurality of the openings are arranged at the plurality of the connecting parts, and aligned to part of the plurality of the gaps respectively. The adhesive tape fixes the plurality of the packaging areas, the plurality of the connecting parts, the chip holder and the plurality of the pins.

Description

technical field [0001] The present invention relates to a lead frame for a leadless package, in particular to a lead frame used in a quad flat non-leaded package (QuadFlat Non-leaded Package; QFN). Background technique [0002] In order to adapt to the trend of consumer electronic products emphasizing thinness and shortness, QFN packaging has surpassed the traditional leaded packaging and is used to replace the higher-cost wafer-level chip-scale packaging (wafer level CSP). Although chip-scale packaging (CSP) The package outline is reduced to the chip size, but an array of solder balls with close spacing must be used as component pins, which makes product manufacturing more difficult. Compared with the QFN package, it is not only small in size, low in cost, and high in production yield, but also provides better coplanarity and heat dissipation for high-speed and power management circuits. In addition, the QFN package does not need to lead pins from both sides, so the electri...

AI Technical Summary

Problems solved by technology

When the cutting knife 80 cuts the lead frame 12, it will cause greater wear to the blade, that is to say, the life of the cutting knife 80 will be shorter due to the cutting of metal materials, so that the frequency of replacing the new knife will be faster

If the cutting speed is sacrificed to slow down the degree of wear of the cutting knife 80, it will inevitably cause the unit hour output (UPH) to decline without yield benefit

Images