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Method for producing polishing composition

A grinding method and composition technology, applied in the direction of polishing compositions containing abrasives, grinding machine tools, manufacturing tools, etc., can solve the problems of not finding abrasive compositions, etc.

Inactive Publication Date: 2009-05-27
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in metal abrasive compositions, there are compositions with large dents and compositions with small dents, and it has not been found that the abrasive composition with controllable dents can be easily obtained.

Method used

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  • Method for producing polishing composition
  • Method for producing polishing composition
  • Method for producing polishing composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0094] Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited by these Examples.

Synthetic example

[0096] Hereinafter, although the synthesis examples of the azole group-containing compound containing 3 or more azole groups are shown, this invention is not limited to these synthesis examples.

[0097] In the 500ml flask equipped with thermometer, stirring device, nitrogen inlet tube and reflux condenser, add 40g of 2-propanol, under nitrogen atmosphere, while stirring, be warming up to reflux temperature (about 83 ℃). 46.31 g of 1-vinylimidazole, 43.69 g of N-vinylpyrrolidone, and 28.5 g of 2-propanol in which 1.46 g of α-methylstyrene dimer was dissolved were dissolved in 78 g of 2-propanol , the resulting liquid (hereinafter referred to as monomer solution.) and 2.45 g of dimethyl-2,2'-azobis (2-methylpropionate) were dissolved in 213.5 g of 2-propane The liquid formed in alcohol (hereinafter referred to as initiator solution 1) is added to the above-mentioned device system with quantitative pumps. Addition time: 4 hours for the monomer solution and 7 hours for the initi...

Embodiment 1

[0114] Compound E having a molecular weight of 5000 was used as the azole-based compound.

[0115] As a polishing machine, Mirra manufactured by Applaid Material Co., Ltd. was used to evaluate an 8-inch wafer. Polishing was performed at a relative speed of the substrate and the polishing table at 75 m / min, a polishing composition supply rate of 200 ml / min, and a pressure of 14 kPa.

[0116] As a polishing pad, IC1000 (k-XY groove) manufactured by Rode Lunita Co., Ltd. was used. In producing the abrasive composition, a preliminary composition having the composition shown in Table 1 was used. The component other than the components shown in the table of each composition is water, and the amount of each component in the table is expressed in mass % with respect to the total mass of the composition including water. Of the bases used, ammonia was used only in the amount corresponding to which the pH values ​​in the table were obtained. Among them, APS stands for ammonium persulf...

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Abstract

The present invention provides a method for producing an abrasive composition, which can control dishing, a method for polishing a substrate using the abrasive composition, and a method for producing a substrate. In the method for producing an abrasive composition, two kinds of preliminary compositions (A) and (B) having different compositions are mixed in different mixing ratios to produce plural kinds of abrasive compositions, wherein a composition containing (a) an abrasive grain, (b) an oxidizing agent, (c) one or more acids selected from the group consisting of amino acids, organic acids and inorganic acids, and (d) a surfactant is used as the preliminary composition (A); and a composition containing (a) an abrasive grain and (b) an oxidizing agent is used as the preliminary composition (B). The preliminary composition (B) may contain the foregoing acid (c) and surfactant (d). In this case, at least one of (a), (b), (c) and (d) in the preliminary composition (A) has a different concentration from that in the preliminary composition (B).

Description

technical field [0001] The present invention relates to a method for producing an abrasive composition for polishing a substrate, in particular to a method for producing an abrasive composition for polishing a metal part of a substrate. In addition, the present invention also relates to a method of polishing a substrate using the manufactured polishing composition and a method of manufacturing the substrate. Background technique [0002] Due to the technological progress of IC (Integrated Circuit) and LSI (Large-Scale Integration), their operating speed and integration scale have increased, for example, it is possible to quickly realize high-performance microprocessors and large-capacity memory chips. Microfabrication technology greatly contributes to their high performance. As one of such microfabrication techniques, there is a chemical mechanical polishing method as a planarization technique. This chemical mechanical polishing method has been used to planarize interlayer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304C09K3/14B24B37/00
CPCC09G1/02C23F3/04H01L21/3212H01L21/7684C09K3/1454
Inventor 佐藤孝志高桥浩岛津嘉友伊藤祐司
Owner RESONAC HOLDINGS CORPORATION