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Method for cutting wafer

A technology of wafers and dicing tapes, applied to fine working devices, electrical components, circuits, etc., can solve problems such as productivity satisfaction

Inactive Publication Date: 2009-06-17
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is necessary to carry out the process of moving and attaching the wafer with laser processing grooves formed along the interval to the dicing tape, which may not be able to meet the requirements in terms of productivity.

Method used

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Embodiment Construction

[0031] Preferred embodiments of the method for dividing a wafer according to the present invention will be described in more detail below with reference to the drawings.

[0032] figure 1 An optical device wafer 10 divided by the wafer dividing method of the present invention is shown. figure 1 In the shown optical device wafer 10, a plurality of regions are divided by grid-like partitions 101 on the surface 10a of a sapphire substrate with a diameter of, for example, a plurality of light emitting diodes, etc., formed on the divided regions. Device 102 .

[0033] When the optical device wafer 10 configured as described above is divided into individual optical devices 102 along the lanes 101, the optical device wafer 10 is first attached to the surface of a dicing tape attached to a ring frame. However, since the optical device wafer 10 has a relatively small diameter of 50 mm as described above, if it is divided one by one, the productivity is poor. figure 2 As shown, each...

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Abstract

The invention provides a wafer segmentation method capable of effectively segmenting a plurality of wafers along the spacing track in clathrate shape. The wafers are segmented into a plurality of areas along the spacing track in clathrate shape and a plurality of devices are formed on the segmented areas, and the wafers are segmented into the devices using the wafer segmenting method along the spacing track in clathrate shape. In the wafer segmentation method, a plurality of optical device wafers are stuck on the surface of the segmentation zone of a ring frame, and the wafer segmentation method comprises the following steps: laser processing groove forming steps of forming the laser processing groove along the spacing track on the wafers by respectively radiating the laser beam on the wafers along the spacing track; segmenting step of segmenting the wafers into a plurality devices along the spacing track for forming the laser processing groove; and a collecting step of stripping the devices from the segmentation zone and collecting the devices.

Description

technical field [0001] The present invention relates to a method for dividing a wafer. The surface of the wafer is divided into a plurality of regions by grid-shaped spacers, and a plurality of devices are formed on the divided regions. The method for dividing the wafer is along the The lanes divide the wafer into individual devices. Background technique [0002] Optical device wafers are divided into a plurality of regions on the surface of a sapphire substrate or the like by dividing lines called streets formed in a grid pattern, and optical devices such as gallium nitride-based compound semiconductors are stacked on the divided regions. , the optical device wafer is divided into light-emitting diodes and other optical devices along the interval lanes, and is widely used in electrical equipment. [0003] Cutting of such an optical device wafer along the lanes is generally performed by a cutting device in which a cutting blade rotates at a high speed and cuts. However, si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
CPCH01L21/681H01L21/78
Inventor 荒井一尚
Owner DISCO CORP
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