Chemical-mechanical polishing liquid for copper process
A chemical mechanical and polishing liquid technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems that cannot meet the requirements of copper process polishing rate and selectivity ratio, wafer surface defects, pollution residues, etc., to achieve The effect of reducing substrate surface contamination, sticking and other residues, and preventing local and overall corrosion
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Embodiment 1~9
[0022] Table 1 has provided polishing liquid 1~9 of the present invention, with formula in the table, each composition is mixed, and deionized water is surplus, finally with pH adjusting agent (20%KOH or dilute HNO 3 , select according to the needs of the pH value) to adjust to the required pH value, continue to stir until a uniform fluid, and stand still for 30 minutes to obtain various chemical mechanical polishing fluids.
[0023] Table 1 Polishing liquid 1~9 formula of the present invention
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