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Wafer on-line detection method and on-line detection device

A detection device and detection method technology, applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve the problem of poor analysis accuracy of detection results, and achieve the effects of improving analysis accuracy, accurate judgment, and improved accuracy

Active Publication Date: 2009-06-17
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

[0010] The present invention provides an online wafer detection method and an online detection device to improve the existing wafer detection method, where the detection point data cannot represent the detection data of the entire wafer, resulting in poor analysis accuracy of detection results question

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  • Wafer on-line detection method and on-line detection device

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no. 1 example

[0051] The first embodiment of the present invention introduces a new method for on-line detection of wafers. The selection of detection points is different from that of traditional methods, which can effectively improve the relationship between the fitting curve of each detection point data and the actual detection data of the entire wafer. The degree of coincidence between the fitted curves.

[0052] In the traditional wafer detection method, the selection of each detection point is determined according to the position distribution of each periodically arranged unit on the wafer, such as figure 1 As shown, 9 to 13 units are usually selected symmetrically with the center of the wafer as the center, and the distribution of the detection results is obtained by testing the detection area of ​​each selected unit, and the actual distribution of the entire wafer is deduced from the obtained distribution. Process condition. However, practice shows that the data distribution of dete...

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Abstract

The invention discloses a wafer on-line detecting method, the steps of the method comprise providing a to-be-detected wafer, wherein a plurality of units are periodically arrayed on the to-be-detected wafer, and each unit is internally provided with a detecting area, determining whether the detecting areas are in the corresponding units or not, determining the distribution of the detecting areas on the to-be-detected wafer according to the position of the detecting areas in the corresponding units, selecting a plurality of to-be-detected units according to distribution of the detecting areas on the to-be-detected wafer, detecting the detecting areas of the pluralities of to-be-detected units, and obtaining detecting data. The invention further discloses a corresponding wafer on-line detecting device, after utilizing the wafer on-line detecting method and the on-line detecting device of the invention, obtained detecting data can relatively accurately stand for the detecting data of the whole wafer, thereby increasing the analyzing accuracy of detecting results.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an on-line detection method and an on-line detection device for a wafer. Background technique [0002] The integrated circuit manufacturing process is a planar manufacturing process, which combines photolithography, etching, deposition, ion implantation and other processes to form a large number of various types of complex devices on the same substrate and connect them to each other to have a complete electronic functions. Wherein, a problem in any step of the process may lead to failure in the manufacture of the circuit. Therefore, in the prior art, on-line detection is often performed on the production results of each step of the process, such as on-line detection of the growth thickness of the film, the depth of etching, the accuracy of lithography overlay, etc., and the data obtained from the detection Carry out analysis to judge whether the process cond...

Claims

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Application Information

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IPC IPC(8): H01L21/66
Inventor 李健胡骏
Owner SEMICON MFG INT (SHANGHAI) CORP
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