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Silica gel board used for circuit board compressing and compressing method using the board

A technology of circuit boards and iron plates, which is applied in the field of burning iron plates and pressing circuit boards using the burnt iron plates, can solve the problems of insufficient FPC bonding force, uneven surface of FPC, and affecting the yield of FPC products, etc. The effect of achieving excellent flatness

Active Publication Date: 2009-06-17
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when pressing a flexible printed circuit board, if the pressing pressure is too small, the bonding force of the FPC may not be sufficient; if the pressing pressure is too high, the surface of the FPC may be uneven, thus affecting the FPC. product yield

Method used

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  • Silica gel board used for circuit board compressing and compressing method using the board
  • Silica gel board used for circuit board compressing and compressing method using the board
  • Silica gel board used for circuit board compressing and compressing method using the board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Under the pressing condition of 80 tons of pressure, the use of a burnt iron plate with a thickness ratio of silicone rubber to iron plate of about 0.6 to 1.5:1 is used to provide the effect of correcting the parallelism of the circuit board in the pressing system. The test results evaluate the effectiveness of the burnt iron plate to correct the parallelism by the flatness of the FPC, the warpage of the burnt iron plate and the service life. The measurement of the experimental results was evaluated as described above. The results are shown in Table 1 below.

[0029] Table 1

[0030]

[0031] FPC flatness: ○ means good flatness, × means poor flatness

[0032] Warpage of burnt iron plate: ○ indicates good, × indicates poor

[0033] As shown in Table 1, when the thickness ratio of silicone rubber to iron plate ranges from 0.6 to 1.5:1, such as 1:1, burnt iron plate sample A (silicone rubber hardness 45HR) has better efficacy. However, if the hardness of silicone ru...

Embodiment 2

[0035] In the range of silicone rubber hardness from 40 to 80, burnt iron plates with different hardness ranges and specific thickness ratios were selected. Under the pressing condition of 80 tons of pressure, the effect of providing circuit board parallelism correction in the pressing system was tested. . The test results evaluate the effectiveness of the burnt iron plate to correct the parallelism by the flatness of the FPC, the warpage of the burnt iron plate and the service life. The measurement of the experimental results was evaluated as described above. The results are shown in Table 2 below.

[0036] Table 2

[0037]

[0038] FPC flatness: ○ means good flatness, × means poor flatness

[0039] Warpage of burnt iron plate: ○ indicates good, × indicates poor

[0040] As shown in Table 2, when the silicone rubber hardness ranges from 40 to 50HR (for example, the hardness is 45HR, sample E and sample G), the thickness ratio of the silicone rubber to the iron plate of...

Embodiment 3

[0042] In the range of silicone rubber hardness from 50 to 80, burnt iron plates with different hardness ranges and specific thickness ratios were selected. Under the pressing condition of 80 tons of pressure, the effect of providing circuit board parallelism correction in the pressing system was tested. . The test results evaluate the effectiveness of the burnt iron plate to correct the parallelism by the flatness of the FPC, the warpage of the burnt iron plate and the service life. The measurement of the experimental results was evaluated as described above. The results are shown in Table 3 below.

[0043] table 3

[0044]

[0045]

[0046] FPC flatness: ○ means good flatness, × means poor flatness

[0047] Warpage of burnt iron plate: ○ indicates good, × indicates poor

[0048] As shown in Table 3, when the silicone rubber hardness ranges from 50 to 65HR (for example, the hardness is 60HR, sample I and sample K), the thickness ratio of the silicon rubber to the iron...

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Abstract

The invention discloses a coating iron plate for compressing circuit board, and comprises a plate and silicon rubber which adheres on the surface of the plate by gel, wherein the silicon rubber has a specific hardness range, and the silicon rubber and the plate have a specific thickness ratio. The coating iron plate is characterized by small angularity and long service life, and circuit boards compressed by the coating iron plate have excellent flatness. The invention also provides circuit board compression method which employs the coating iron plate to implement compression in a specific pressure range to obtain circuit boards of excellent flatness.

Description

technical field [0001] The invention relates to a burnt iron plate used for pressing circuit boards and a method for pressing circuit boards using the burnt iron plate, in particular to a burnt iron plate used for pressing flexible printed circuit boards and A method for pressing and bonding flexible printed circuit boards using the burnt iron plate. Background technique [0002] A flexible printed circuit board (Flexible Printed Circuit, FPC) can be used to carry electronic components, so that the electronic product can perform its intended function. Due to the characteristics of flexibility and three-dimensional space wiring, flexible circuits are currently widely used in computers and their peripheral equipment and communication products under the development trend of technological electronic products that emphasize lightness, shortness, and flexibility. And consumer electronics, etc. [0003] In recent years, electronic products have been developing towards miniaturiza...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 李建辉林志铭向富杕
Owner KUSN APLUS TEC CORP