Electronic device

Abstract

The invention discloses an electronic device comprising a casing, a plurality of radiating fins and a radiating fan, wherein the casing comprises a containing space and an opening for communicating the containing space with outside, and further comprises a power socket which is arranged in the containing space, the radiating fins are arranged in the containing space, the radiating fan comprises a power plug-in portion which is corresponding to the power socket in the casing, the radiating fan is arranged in the containing space of the casing through the opening for supplying radiating airflow to the radiating fins, when the radiating fan is inserted into the containing space, the power plug-in portion is inserted on the power socket, the radiating fan can be removed from the casing through the opening for cleaning the radiating fan and the radiating fins, thereby air flow passages between the radiating fan and the radiating fins can not be blocked, and keep smooth flowing of the air, which maintains good radiating effect.

Description

technical field [0001] The invention relates to a heat dissipation mechanism of an electronic device, in particular to a heat dissipation mechanism that is easy to disassemble and clean. Background technique [0002] As shown in Fig. 1, Fig. 2 and Fig. 3, the heating element 12 (such as the central processing unit or graphics processing chip, etc.) 13. Exhaust the hot air generated by the heating element 12 to the outside of the casing 11, so as to prevent the notebook computer 1 from crashing due to overheating. However, because the air contains dust or suspended particles, when the air passes through the fan 131 and the heat dissipation fins 132 of the heat dissipation module 13, the dust will be attached to the fan 131 and the heat dissipation fins 132. Finally, the adhesion of dust will become more and more serious, causing the air channel in the heat dissipation module 13 to be blocked and the air flow to be difficult, so that the heat dissipation efficiency will deter...

AI Technical Summary

Problems solved by technology

Usually, on the heat sink 135 ( FIG. 4 ), which is located on the bottom surface of the housing 130 and connected to the heat pipe 133 , a heat dissipation paste (not shown) will be coated as a heat conduction medium with the heating element 12 , so the heat dissipation module 13 After the casing 130 is detached from the main body 110 of the casing 11, the thermal paste between the heat sink 135 and the heating element 12 will be damaged. The heat of the heating element 12 will not be effectively transferred to the heat sink 135 through the heat dissipation paste, resulting in poor heat dissipation.

Again, the cooling fin 135 needs to keep a certain pressure applied on the heating element 12. If the strength of the housing 130 re-locked on the body 110 is insufficient or uneven, it will cause poor contact between the cooling fin 135 and the heating element 12. poor heat dissipation

Furthermore, the fan 131 is connected with a wire 136, and the end of the wire 136 is provided with a power socket 137. When the cooling module 13 is assembled or disassembled from the body 110 of the casing 11, one more step is required to plug the power socket 137. The assembly or disassembly of the heat dissipation module 13 can only be completed by connecting or unplugging the power socket (not shown) of the main body 110, which increases the inconvenience of the disassembly process.

[0005] Due to the complicated disassembly process between the heat dissipation module 13 and the casing 11, the process of cleaning the fan 131, the heat dissipation fins 132 and the inside of the housing 130 of the heat dissipation module 13, or when the fan 131 fails and needs to be replaced, the process is relatively complicated. and inconvenience

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