Solvent-free conductive adhesive constituent and solar energy cell assembly with the same

A technology of conductive adhesive and composition, which is applied in the direction of electrical components, conductive adhesives, semiconductor devices, etc., and can solve problems such as increased series impedance, blurring, and reduced photoelectric conversion efficiency

Inactive Publication Date: 2009-07-08
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as mentioned above, currently known conductive adhesives are solvent-based formulations containing solvents. When making silver electrodes on the light-receiving surface, the surface of the wafer is roughened. The capillary phenomenon causes blurring, and the flow of the glue due to gravity or the volatilization of the solvent during baking will cause the line width to increase and the thickness to decrease. At the same time, the shading area will increase and the series impedance will increase, thus reducing the photoelectric conversion efficiency.

Method used

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  • Solvent-free conductive adhesive constituent and solar energy cell assembly with the same
  • Solvent-free conductive adhesive constituent and solar energy cell assembly with the same
  • Solvent-free conductive adhesive constituent and solar energy cell assembly with the same

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Experimental program
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Embodiment

[0050] Table 2 shows the composition ratio of a solvent-free silver conductive adhesive according to the present invention.

[0051] Table 2

[0052]

[0053] The components of the adhesive are as follows:

[0054] Monomer 1: 2-phenoxyethyl acrylate (produced by Eternal Company, trade name By.

[0055]Monomer 2: Triethylene glycol dimethacrylate (produced by Eternal Company, trade name By).

[0056] Oligomer: aliphatic urethane acrylate (produced by Eternal Company, trade name By)

[0057] Acrylate polymer: polyester hexaacrylate (produced by Eternal Company, trade name By).

[0058] After pre-mixing the components according to the ratio in Table 2 to prepare the adhesive, add a dispersant (TEGO company's ) and photoinitiator (produced by Ciba Company, trade name IRGACURE 907), add glass powder after stirring and mixing (NEG Company's ) and silver powder (Metalor’s ), to prepare a silver conductive adhesive by dispersing it. During the preparation process,...

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Abstract

The invention provides a nonsolvent conductive adhesive composition. The nonsolvent conductive adhesive composition comprises (a) an adhesive; (b) an evocating agent, (c) glass powder, and (d) conductive powder. The invention also provides a solar cell component; and the solar cell component comprises an electrode or a conducting wire which is formed through the coating of the conductive adhesive composition on a silicon semiconductor substrate and sintering of the silicon semiconductor substrate. As the conductive adhesive comprises no solvent, the conductive adhesive has no problem of environmental pollution caused by solvent volatilization, is not easy to diffuse, is favorable for the design of thinning and high depth-to-width ratio, and can effectively increase photoelectric conversion efficiency of the solar cell component.

Description

technical field [0001] The present invention relates to a conductive adhesive composition and a solar cell module using the composition, especially a conductive adhesive composition used to form electrodes or wires on a silicon semiconductor substrate of a silicon crystal solar cell module, and the use of the conductive adhesive Composition manufactured solar cell modules. Background technique [0002] Due to the increasingly serious environmental problems such as energy shortage and greenhouse effect, various countries have actively researched and developed various alternative energy sources, especially solar power generation, which has attracted the most attention from all walks of life. figure 1 That is, the schematic diagram of the cross-sectional structure of the solar cell module, which is to make the surface into a pyramid-shaped rough surface on the p-type silicon semiconductor substrate 1 to reduce light reflection (for a simplified diagram, figure 1 roughened surf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J4/00H01L31/0224H01L31/02H01L31/18
CPCY02P70/50
Inventor 许再发
Owner ETERNAL MATERIALS CO LTD
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