Condenser type touch screen substrate attaching method

A screen substrate and capacitive technology, which is applied in the field of capacitive touch screen substrate bonding, can solve problems such as easy generation of air bubbles and glue overflow, and achieve the effect of improving product quality

Inactive Publication Date: 2009-07-15
深圳市中显微电子有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0007] The purpose of the present invention is to provide a bonding method for the upper and lower substrates of a capacitive touch screen, aiming to solve the defects of possible accompanying glue overflow and easy generation of air bubbles when the existing upper and lower substrates are bonded

Method used

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  • Condenser type touch screen substrate attaching method
  • Condenser type touch screen substrate attaching method
  • Condenser type touch screen substrate attaching method

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] see Figure 8 , the bonding method of the capacitive touch screen substrate provided by the present invention comprises the following steps in turn:

[0029] 1.1 First select any one of the prepared upper and lower substrates, such as the upper substrate 11, use a curable adhesive, and make a frame glue 31 with at least one opening 33 along the periphery of the bonding surface of the substrate. The specific shape of the glue is as follows: image 3 As shown, it is the frame made of glue; the adhesive can be selected from ultraviolet curing glue or heat curing glue, and the specific number ...

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Abstract

The present invention provides a capacitor type touch screen substrate adhibiting method which comprises the following main steps: firstly, preparing a strip of frame adhesive with an opening by adhesive on the perimeter of abutted surface of substrate of one prepared substrate; after attaching the upper substrate and the lower substrate together, forming a cavity between two abutted surfaces of substrate; executing vacuum pumping to the cavity through an opening; after contacting the opening with the liquid adhesive, pressurizing the periphery of adhesive so that the adhesive is injected into the cavity depending on the vacuum differential pressure or capillarity; and finally solidifying the adhesive injected into the cavity thereby obtaining the finished product of capacitor type touch screen. The invention can reduce or avoid the air bubble generated in attaching the upper substrate and the lower substrate and has the advantages of increased product quality, increased finished product rate, increased production efficiency, etc.

Description

technical field [0001] The invention relates to a manufacturing method of a capacitive touch screen, in particular to a bonding method for upper and lower substrates of a capacitive touch screen substrate. Background technique [0002] The touch screen can be used as an interface tool for operating electronic devices through the display screen, allowing users to input information directly on the surface of the display device with a touch screen by touching or handwriting, which is more friendly and convenient than input devices such as mice and keyboards. Therefore, it is more and more widely used in various portable devices, such as mobile phones, PDAs and so on. For example, a user may input desired information on a display device that is displaying an image and is combined with a touch screen. [0003] According to the type of contact object used (such as fingers, pens, etc.) and the way of confirming the contact (the position where the contact object operates the touch ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/044
Inventor 姚伏恒
Owner 深圳市中显微电子有限公司
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