Method for avoiding solder bridge
A technology of tin bridging and tin liquid is applied in the field of avoiding improper solder bridging between two adjacent solder joints, so as to improve the pass rate, reduce maintenance costs and reduce negative effects.
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[0051] According to the welding theory, the smaller the distance between the parts holes, the easier it is to cause the phenomenon of tin connection (bridging). In order to prevent the phenomenon of tin connection (bridging) during soldering when the spacing between the parts feet is ≤ 2mm and the gap between the parts holes corresponding to the parts feet on the printed circuit board is ≤ 0.6mm, the present invention uses between two parts holes Solder mask material to be isolated. For example, a steel sheet with a thickness of 0.1-0.2mm is used to set up multiple dams or retaining walls with a width of 0.15-0.20mm, that is, isolation strips (lines), which can isolate and block the tin liquid during welding, effectively preventing two The phenomenon of tin connection (bridging) occurs in adjacent parts holes.
[0052] see figure 1 shown. In order to solve electronic products, such as the pin seat of the central processing unit in the wave soldering, the last row of part p...
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