Protection cover manufacturing method capable of preventing electromagnetic wave interference

A manufacturing method and technology of protective cover, which are applied in electrical components, magnetic field/electric field shielding, ion implantation plating, etc., can solve the problems of high material cost, scrapping, and cumbersome combined structure, achieve lightweight processing and molding, overcome end face The effect of smoothing and shortening the production process

Inactive Publication Date: 2009-07-22
郑育仁
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the known method of manufacturing a shielding structure that can prevent electromagnetic interference still has the following problems in actual use. Because it connects each metal cover body to the machine board one by one, a large amount of manpower is required for alignment. The connection work is carried out by welding, and it cannot be disassembled and separated again when a defect occurs in the process. It is often disposed of in a scrapped manner, which makes the manufacturing cost high; in addition, it uses a metal cover to cover each electronic component. Cover, not only the cost of materials is high, but also the overall combined structure is quite bulky, which cannot meet the light weight requirements of electronic products; it really needs to be improved

Method used

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  • Protection cover manufacturing method capable of preventing electromagnetic wave interference
  • Protection cover manufacturing method capable of preventing electromagnetic wave interference
  • Protection cover manufacturing method capable of preventing electromagnetic wave interference

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Embodiment Construction

[0035] The detailed description and technical content of the present invention are described below with accompanying drawings. However, the attached drawings are provided for reference and illustration only, and are not intended to limit the present invention.

[0036] The protective cover for preventing electromagnetic wave interference produced by the present invention mainly includes a casing 1 and a metal coating layer 20 , wherein the casing 1 is made of plastic material.

[0037] Please refer to Figure 1 to Figure 6 As shown, the present invention provides a method for manufacturing a protective cover capable of preventing electromagnetic wave interference, the steps of which include:

[0038] a), provide mold 6 (such as figure 2 shown); in this step, the mold 6 is made up of an upper module 61 and a lower module 62, and a recessed groove 621 in the shape of a protective cover is processed inside the lower module 62; The grooves 621 correspond to the convex parts 611...

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Abstract

The present invention relates to a method for manufacturing a protecting cover which can prevent the electromagnetic wave interference, wherein the method comprises the following steps: preparing a mold; executing compression fitting with the mold to the plastic film which is formed with a base board, side boards and dividing strips for forming the casing with a protecting cover; and plating the metal coating layer on the surface of casing. Therefore the mutual interference of electromagnetic wave of each module in different areas can be effectively prevented.

Description

technical field [0001] The invention relates to a protective cover, in particular to a method for making a protective cover capable of preventing electromagnetic wave interference. Background technique [0002] Most communication products are high-frequency products, and the electronic components inside it are easy to generate electromagnetic waves. In order to avoid electromagnetic waves that interfere with each other and affect the quality of signal transmission between electronic components or modules combined with the board; A shielding structure that prevents electromagnetic wave interference is wrapped around the component or module to solve this problem. [0003] The known method of manufacturing a shielding structure that can prevent electromagnetic wave interference is mainly to use a plurality of metal covers to cover each electronic component on a board equipped with a plurality of electronic components, and to cover part of the copper foil circuit on the board C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K5/03C23C14/34B29C51/08B29C51/30B29C51/26B29K25/00B29K69/00B29K55/02B29K23/00B29K67/00B29K71/00B29K27/18B29K77/00
Inventor 郑育仁
Owner 郑育仁
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