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Disc wafer inspecting device and inspecting method

An inspection device, disc-shaped technology, applied in the direction of measuring devices, optical devices, electronic circuit testing, etc., can solve problems such as fluctuations, evaluation of areas that cannot be processed, and good accuracy

Inactive Publication Date: 2012-04-04
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when viewed carefully, the shape of the outer edge of the semiconductor wafer, which affects the exposed width, is not necessarily constant but may fluctuate.
Therefore, the processing region formed on the surface of the disk-shaped substrate cannot be evaluated with high accuracy by the conventional method.

Method used

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  • Disc wafer inspecting device and inspecting method
  • Disc wafer inspecting device and inspecting method
  • Disc wafer inspecting device and inspecting method

Examples

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Embodiment Construction

[0059] Embodiments of the present invention will be described below using the drawings.

[0060] The mechanism system (first configuration example) of the inspection device for semiconductor wafers (disk-shaped substrates) according to one embodiment of the present invention is as follows: figure 1 with figure 2 constructed in the manner shown. figure 1 It is a diagram of the mechanism system of the inspection device viewed from the side, figure 2 is a view of the mechanism system of the inspection device viewed from above.

[0061] exist figure 1 with figure 2 Among them, the table 100 (holding unit) is held by the rotating shaft 110a of the rotation driving motor 110 (rotation driving unit), and can continuously rotate in one direction (clockwise direction indicated by arrow S in this embodiment). A semiconductor wafer (hereinafter simply referred to as a wafer) 10 as a disk-shaped substrate is placed on a stage 100 in a horizontal state. In addition, an alignment m...

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PUM

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Abstract

The invention relates to an inspecting device and method for inspecting a processed region formed on the surface of a disc wafer such as a semiconductor wafer with higher accuracy. The inspecting device comprises imaging means (130a, 130b) for imaging the periphery and its neighboring region of a rotating wafer, wafer periphery position measuring means (200) for measuring the radial position of the periphery at each of the rotation angle positions Theta n of the wafer from the images captured by the imaging means (130a, 130b), periphery-to-periphery distance measuring means (200) for measuring the periphery-to-periphery distance B<Theta n> between the periphery of the wafer and that of an insulating film at each of the rotation angle positions Theta n with reference to the captured images, and inspection information creating means (200) for creating predetermined inspection information from the radial position A<Theta n> of the periphery of the wafer and the periphery-to-periphery distance B<Theta n>.

Description

technical field [0001] The present invention relates to an inspection device and inspection method for disc-shaped substrates such as semiconductor wafers, and more particularly to an inspection device and an inspection method for inspecting disc-shaped substrates on which processing regions such as insulating films and conductive films are formed on the surface. Background technique [0002] A semiconductor wafer (one type of a disk-shaped substrate) undergoes a film-forming process and an etching process to form, for example, concentrically processed regions such as an insulating film and a conductive film on the surface. Conventionally, there has been proposed a method of judging whether or not the edge portion of the processed region (insulating film, etc.) formed on the semiconductor wafer is in a normally completed state without warpage or the like (see Patent Document 1). In this method, a plurality of locations of the outer edge portion of the semiconductor wafer is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01B11/24
CPCG01R31/311G01N21/9503G01B11/08G01B11/24H01L22/00
Inventor 林义典古川长树森秀树堀徹真
Owner SHIBAURA MECHATRONICS CORP