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Light-emitting diode (LED) and method for preparing LED and base of LED

A technology for a light-emitting diode and a manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., can solve the problems of easy generation of holes, inability to miniaturize zener diodes, and damage to the reliability of light-emitting diodes.

Active Publication Date: 2012-03-28
BRIGHT LED ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Zener diodes of surface mount technology cannot be miniaturized (the current minimum size is 0402 (1.0×0.5mm)), and a specific rectangular Zener diode is required. When the plastic is injected to form the base 21, the plastic flows through the Zener diode The corners (sharp corners) of 23 cannot tightly cover the Zener diode 23 and easily generate holes (covered air), resulting in defects in the molded base 21 and damaging the reliability of the light emitting diode 2

Method used

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  • Light-emitting diode (LED) and method for preparing LED and base of LED
  • Light-emitting diode (LED) and method for preparing LED and base of LED
  • Light-emitting diode (LED) and method for preparing LED and base of LED

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Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0021] refer to Figure 4 and Figure 5 , The first preferred embodiment of the light emitting diode 3 and its manufacturing method of the present invention includes a base 4 , a crystal grain 5 and a transparent colloid 6 . The base 4 includes a plastic base 41 , a metal bracket 42 , a zener diode 43 , a wire 44 and a covering glue 45 .

[0022] The plastic base 41 has a bottom wall 412 and a ring wall 413 defining a groove 411. The material is opaque and highly reflective. In this embodiment, the plastic base 41 is made of white thermoset type resin (by injection molding or compression molding). The metal bracket 42 has two legs 421, 422 spaced apart from each other, accommodated in the plastic base 41 and partly exposed from the plastic base 41, one end of each of the legs 421, 422 is exposed on the bottom wall 412, and the other end extends hor...

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PUM

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Abstract

The invention provides a light-emitting diode (LED), and a method for preparing the LED and a base of the LED, in particular to an LED. The LED comprises two spacing supporting legs, a Zener diode, a coating colloid and a plastic base. The Zener diode is arranged on one supporting leg, electrically connected with the supporting leg and electrically connected with the other supporting leg by a conductor wire. The coating colloid covers and completely shields the Zener diode and the conductor wire; furthermore, the plastic base accommodates and completely shields the coating colloid so that the grains can be arranged at the very center of the groove of the base, thus avoiding the Zener diode absorbing the light beam emitted by the grains. The coating colloid can protect the Zener diode before the plastic base is formed; furthermore, as the surface is a smooth arc, the plastic base can be attached to the coating colloid closely and is not easy to generate cavities when being formed.

Description

technical field [0001] The invention relates to a light-emitting diode with a protection circuit, in particular to a light-emitting diode with a zener diode, a base of the light-emitting diode and a manufacturing method thereof. Background technique [0002] refer to figure 1 , is a light emitting diode 1 in the past, which has a crystal grain 11 , a base 12 , two pins 13 and an encapsulating colloid 14 . The base 12 is made of insulating material such as plastic, and forms a groove 121. Two pins 13 penetrate the base 12 and extend into the groove 121. The crystal grain 11 is arranged on the top surface of one of the pins 13, and is electrically connected to the base 12. Connect the two pins 13, in order to prevent electrostatic discharge (Electrostatic Discharge, ESD) from damaging the die 11, a Zener diode 15 is provided on the top surface of the other pin 13, the Zener diode 15 is electrically connected to the two pins 13, and is connected to the die 11 are connected in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L33/00H01L23/488H01L23/31H01L21/50H01L21/60H01L21/56H01L21/48
CPCH01L2224/48091H01L2924/3025H01L2924/3011
Inventor 张铭利陈炎成
Owner BRIGHT LED ELECTRONICS CORP