Electronic circuit device and method for manufacturing the same
A technology for electronic circuits and main circuits, applied in printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of poor volume efficiency, difficulty in ensuring vibration resistance, and large-scale inverter modules, and achieve excellent assembly. Effect
Inactive Publication Date: 2010-11-17
AISIN AW CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0011] (1) In the structure disclosed in the above-mentioned Patent Document 1, in order to fix the positioning of the upper substrate, the height direction position of the lower substrate needs a space dedicated to the support body different from the space occupied by the lower substrate, and the wasted space will increase. Big
As a result, the volumetric efficiency deteriorates and the size of the inverter module increases
[0012] (2) Since the support body is an elongated body extending from the position in the height direction of the lower substrate to the lower surface of the upper substrate, it is difficult to ensure the vibration resistance of the upper substrate
[0013] (3) Ruo Ru Figure 13 As shown, if the support body is positioned and fixed through the metal base plate, the number of screw holes and screws for the support surface corresponding to the number of the support body is required, and the cost will increase.
Method used
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Embodiment Construction
[0070] Embodiments of the present application will be described by taking an inverter module 1 as an electronic circuit device as an example based on the drawings.
[0071] figure 1 is an exploded perspective view of the inverter module 1, figure 2 is its top view, image 3 express figure 2 In the III-III section, Figure 4 (a) means figure 2 In the IV(a)-IV(a) section, Figure 4 In (b) means figure 2 The IV(b)-IV(b) section in it. it's here, Figure 4 (a) is a diagram showing a cross-sectional structure at a position where the supporting frame 3a is removed, wherein the supporting frame 3a is integrally molded with the resin case 3 for positioning the supporting body 2 which is the characteristic configuration of the present application, Figure 4 Among (b) is to represent to have support frame 3a figure 2 A diagram of the cross-sectional structure at the central portion in the up-down direction in .
[0072] as from figure 1 , figure 2 , image 3 , Fig...
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Provided is an electronic circuit device wherein a pair of substrates are arranged in the vertical direction and the periphery of the lower substrate is filled with a filling material. The electronic Provided is an electronic circuit device wherein a pair of substrates are arranged in the vertical direction and the periphery of the lower substrate is filled with a filling material. The electroniccve the lower substrate with the resin in a cured state, is arranged, and the upper substrate (6) is fixed and supported by the supporting body (2).above the lower substrate with the resin in a cured state, is arranged, and the upper substrate (6) is fixed and supported by the supporting body (2).ircuit device is small and low-cost, with high vibration resistance and high reliability of the upper substrate. The electronic circuit device is provided with a lower substrate (5) whereupon a maincircuit device is small and low-cost, with high vibration resistance and high reliability of the upper substrate. The electronic circuit device is provided with a lower substrate (5) whereupon a maincircuit is formed; an upper substrate (6) whereupon a drive control circuit is formed for drive-controlling the main circuit; and a resin case (3), which has an external extraction terminal (9) of thecircuit is formed; an upper substrate (6) whereupon a drive control circuit is formed for drive-controlling the main circuit; and a resin case (3), which has an external extraction terminal (9) of the main circuit and the drive control circuit on an external surface of a peripheral section, and has a substrate storing space inside the peripheral section. A space above the lower substrate (5) is fimain circuit and the drive control circuit on an external surface of a peripheral section, and has a substrate storing space inside the peripheral section. A space above the lower substrate (5) is filled with the filling material by arranging the upper substrate (6) above the lower substrate (5). The filling material is composed of a resin, and a supporting body (2), which is positioned and fixedlled with the filling material by arranging the upper substrate (6) above the lower substrate (5). The filling material is composed of a resin, and a supporting body (2), which is positioned and fixed abo
Description
technical field [0001] The present application relates to an electronic circuit device, and also relates to a method of manufacturing the electronic circuit device. The electronic circuit device includes: a lower substrate on which a main circuit is formed; a side substrate; and a casing having at least a part of the external lead-out terminals of the main circuit and the drive control circuit on the outer surface of the peripheral portion and having a substrate storage space for accommodating at least the lower substrate at a position inside the peripheral portion, which is an upper substrate The arrangement above at least a part of the lower substrate is configured such that the lower substrate is housed in the substrate storage space and the space above the lower substrate is filled with a filling material. Background technique [0002] A typical example of such an electronic circuit device is an inverter module for controlling the operation of a motor. In the inverter m...
Claims
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IPC IPC(8): H01L25/07H01L25/18
CPCH05K3/284H01L24/34H01L23/24H05K2201/10924H01L25/18H05K1/144H01L25/162H01L25/072H05K2201/042H05K3/0061H01L2924/13055H05K2201/2018H01L2924/1305H01L2224/40137H01L2924/181H01L24/40H01L2224/84801H01L2224/83801H01L2924/00014Y10T29/49126H01L24/84H01L2924/00H01L2924/00012H01L2224/37099
Inventor 青木一雄鹤冈纯司安井诚二蒲田靖征矢野伸
Owner AISIN AW CO LTD