Force sensor

A force sensor and pressure technology, applied in the field of micro-electro-mechanical systems, can solve the problems of high difficulty in serialization of product specifications, failure to meet application requirements, and high manufacturing difficulty, and achieve the effects of simple structure, miniaturization, and low cost

Inactive Publication Date: 2009-09-16
许建平
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, known sensors of the same type are composed of elastic bodies, pressure-sensitive resistors attached to the elastic bodies, and contact rods; The external force is directly transmitted to the silicon sensing element, and the silicon sensing element bends and deforms when it is subjected to an external force. The impedance of the silicon sensing element changes in proportion to the external force, and the electrical signal corresponding to the changing force value is obtained through the corresponding circuit; this type of force The manufacturing of sensors is difficult, the cost is high, and the serialization of product specifications is difficult, so the product is relatively single and cannot meet the application requirements

Method used

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Embodiment Construction

[0022] Below in conjunction with preferred embodiment and accompanying drawing, the present invention is further described:

[0023] figure 1 It is a schematic cross-sectional structure diagram of an integrated circuit force sensor of the present invention; wherein, 11 is a rigid insulating open shell, and the cross-section of the outer port of the open shell 11 is smaller than the cross-section of the inner cavity; wherein, the glass base 12, the silicon film 13, and A piezoresistive bridge formed by semiconductor materials is arranged on the silicon film 13, bonding wires 14, and electrical lead pins 15 constitute the silicon film piezoresistive pressure sensitive element of the present invention; the glass base 12 is bonded to the bottom of the housing 11 , the silicon film 13 is bonded on the glass base 12, the electric lead pin 15 is bonded on the housing 11 and drawn out of the shell, and the bonding wire 14 electrically connects the piezoresistive bridge on the silicon ...

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Abstract

The invention relates to a force sensor, in particular to a microminiature force sensor, comprising a shell, a pressure-sensing element, a force coupling medium; wherein, the force coupling medium is made of flexible material and is not bonded with the pressure-sensing element and the inner wall of the shell; insulation material is cured around an electricity in-out bonding lead wire of the pressure-sensing element; a thin film is arranged between the force coupling medium and the pressure-sensing element; the pressure-sensing element is a piezoresistive pressure-sensing element or capacitance pressure-sensing element; the piezoresistive pressure-sensing element is a silicon piezoresistive pressure-sensing element.

Description

Technical field [0001] The present invention relates to a force sensor, in particular to a sensor for detecting pressure, touch force, object mass and weight, and a sensor for acquiring tactile information, which belongs to the field of micro-electromechanical systems, but is not limited thereto. Background technique [0002] At present, known sensors of the same type are composed of elastic bodies, pressure-sensitive resistors attached to the elastic bodies, and contact rods; The external force is directly transmitted to the silicon sensing element, and the silicon sensing element bends and deforms when it is subjected to an external force. The impedance of the silicon sensing element changes in proportion to the external force, and the electrical signal corresponding to the changing force value is obtained through the corresponding circuit; this type of force The manufacturing of sensors is difficult, the cost is high, and the serialization of product specifications is dif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18B81B7/02B81C5/00
Inventor 许建平
Owner 许建平
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