Micro-vibration auxiliary cutting device and method for brittle material

Abstract

The invention relates to a micro-vibration auxiliary cutting device and a method for a brittle material. The method partially comprises the following steps: 1, a preparation step; 2, an initial cutting step; 3, a slot-following vibration step; and 4, a completion step. Therefore, an initial kurf with a first depth on a workpiece on a workpiece fixing part is obtained through the cutting of an initial cutting part; and a vibration contact part moves along the initial kurf and simultaneously produces a slight amount of vibration which is perpendicular to the initial kurf and has a preset frequency, so that the first depth of the initial kurf is deepened to a second depth and the workpiece is further ruptured. Therefore, the cutting device simultaneously has the advantages of being applicable to harder and thicker workpieces to be cut, adopting a minor tungsten carbide or diamond knife flywheel, having a simple structure and low cost, and the like.

Description

technical field [0001] The invention relates to a micro-vibration assisted cutting device and method for brittle materials. Background technique [0002] refer to figure 1 , regarding the cutting operation of traditional brittle materials, taking a single light-transmitting substrate 90 (especially a liquid crystal display panel) as an example, a tungsten carbide or diamond cutter wheel (not shown) is used to cut a cutting line on its upper surface 91. Then, turn over 180 degrees so that the cutting line 91 is located at the lower surface (as figure 2 shown). Next, apply a predetermined pressure or moment (such as image 3 arrow pointing down), that is, an action similar to pulling apart, the single transparent substrate 90 can be separated along the cutting line 91 to complete the cutting operation. [0003] Another traditional cutting method is to use the principle of the average force of air pressure, such as Figure 4 As shown, there is an upper light-transmitting...

AI Technical Summary

Problems solved by technology

However, with the hardness of a single light-transmitting substrate, the cutting depth of tungsten carbide or diamond cutter wheel is also different, especially for objects with higher hardness or thicker, sometimes the cutting depth will be insufficient. Once this is the case, the subsequent action of applying force to pull open or the action of air pressure pushing may lead to problems such as failure to cut, only partial cutting, or poor fracture, resulting in defective products.

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