Light emitting diode surface light source device

A technology of light-emitting diodes and surface light sources, applied in the direction of plane light sources, light sources, point light sources, etc.

Active Publication Date: 2011-05-25
BRIGHT LED ELECTRONICS CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problems existing in the existing light-emitting diode surface light source device, and provide a light-emitting diode surface light source device with a small-sized wafer of a new structure. The technical problem to be solved is to make the light-emitting diode surface light source device be With small size, its light emitting area is between 0.08mm 2 (121mil 2 )-0.25mm 2 (400mil 2 ) light-emitting diode chip, and has the chip spacing value and substrate thickness that can make the chip temperature lower.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode surface light source device
  • Light emitting diode surface light source device
  • Light emitting diode surface light source device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to further explain the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of the light-emitting diode surface light source device proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Efficacy, detailed as follows.

[0037] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, when the technical means and functions adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the accompanying drawings are only for reference and description, and are not used to e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a light emitting diode surface light source device, which comprises a substrate and a plurality of light emitting diode chips arranged on the substrate in array type arrangement. The thickness of the substrate is between 1 and 3 mm. The area of the light emitting diode chip is between 0.08 and 0.25 mm<2>; and the distance between every two light emitting diode chips is more than twice of the dimension of the chip. The light emitting diode surface light source device uses the chip with small dimension and controls the distance between the chips and the thickness of the substrate, can achieve the promotion of luminous efficiency of the whole surface light source device through utilization of the chip with the small dimension, can maintain the temperature of the chip in a lower state, reduce the amplitude needed for radiation and is further favorable for the following radiation design of the whole light emitting diode surface light source device.

Description

technical field [0001] The invention relates to a light emitting diode device, in particular to a light emitting diode surface light source device in which a plurality of light emitting diodes are arranged to form a surface light source. Background technique [0002] see figure 1 Shown is the three-dimensional schematic view of the Taiwan Publication No. 289947 of the prior art. In the case of Taiwan Publication No. 289947, what is disclosed is a technology that a plurality of light-emitting diode chips 91 (hereinafter referred to as chips) are arranged on a substrate 92 to form a side light source, and the size of the chip 91 is below 40mil (especially in the 8mil~14mil), so as to increase the light extraction efficiency and improve the thermal conductivity. [0003] But in fact, in addition to the size of the wafer 91, the distance between the wafers 91 and the thickness of the substrate 92 itself will also affect the heat dissipation of the entire surface light source, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00F21V21/00F21V29/00H01L23/373F21Y101/02F21V29/85F21Y105/12F21Y115/10
Inventor 张铭利陈炎成曾庆霖廖宗仁周政泰
Owner BRIGHT LED ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products