Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed circuit board and method for fabricating a printed circuit board

A printed circuit board, printed wire technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as high cost, achieve small accuracy and improve mechanical stability.

Inactive Publication Date: 2009-09-30
CONTINENTAL AUTOMOTIVE GMBH
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manufacturing this type of printed circuit board therefore entails high costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and method for fabricating a printed circuit board
  • Printed circuit board and method for fabricating a printed circuit board
  • Printed circuit board and method for fabricating a printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Figure 1A to Figure 1C The different production stages for producing a printed circuit board 1 according to the invention are shown. The starting point for manufacturing a printed circuit board 1 according to the invention is a conventional printed circuit board (see Figure 1A ). In the exemplary embodiment, this printed circuit board comprises, for example, five carrier layers 7 , 8 , 9 , 10 , 11 and six metallization layers 12 , 13 , 14 , 15 , 16 , 17 . In this case the carrier layers 8 and 10 are so-called core layers made of printed circuit board material FR4. Metallization layers 13 and 14 or 15 and 16 are applied to these core layers on both sides. The metallization layers 13 , 14 , 15 , 16 are structured in a desired manner before being connected to the carrier layers 7 , 9 and 11 , which form so-called prepreg layers made of FR4. When the core layers 8 and 10 with the metallization layers 13, 14 or 15 and 16 applied thereon and the prepreg layers 7, 9, 11 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
depthaaaaaaaaaa
widthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention realtes to a printed circuit board (1) has a first main side (2) and a second main side (3) disposed opposite the first main side (2). A first and a second rigid zone (4,5) are linked to each other by way of a flexible zone (6) and the flexible zone (6) is embodied thinner than the first and second rigid zones (4,5) perpendicular to the first and second main sides (2,3). The flexible zone has at least one metallization layer (12,13,14,15,16,17) and at least one substrate layer (7,8,9,10,11) formed of an insulating material and connected to the at least one metallization layer (12,13,14,15,16,17). The substrate layer is formed with a plurality of trenches (18) which in each case extend at the most up to one of the one or more metallization layers (12,13,14,15,16,17).

Description

technical field [0001] The invention relates to a printed circuit board having a first main side and a second main side opposite the first main side and first and second rigid regions, the first and second rigid regions being connected to each other by flexible regions, Furthermore, the flexible region is designed perpendicular to the first and second main sides to be thinner than the first and second rigid region. Furthermore, the invention relates to a method for producing a printed circuit board of this type. Background technique [0002] Usually the printed circuit board is designed as a multi-layer printed circuit board. In these multilayer printed circuit boards, alternately arranged metallization layers and insulating carrier layers are arranged one above the other. Such a multilayer printed circuit board allows a greater number of active and passive components to be arranged on the printed circuit board, since their electrical connection can be made by wiring in se...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/18H05K3/00
CPCH05K3/0032H05K1/028H05K2203/0228H05K2201/09036H05K3/0044H05K2201/0191H05K1/0278Y10T29/49124
Inventor D·巴冈
Owner CONTINENTAL AUTOMOTIVE GMBH