Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property

Abstract

Disclosed is a method for producing a metal-coated polyimide resin substrate, which comprises: forming an electroless nickel-plated layer containing a component (B) on both surfaces or one surface of a polyimide resin film; and forming an electrically conductive film on the surface of the electroless nickel-plated layer by the electroless copper plating or the electro copper plating. The method is characterized as follows. Prior to the electroless nickel plating, a treatment of immersing the polyimide resin substrate in a solution comprising an alkali metal hydroxide to thereby render the polyimide resin substrate hydrophilic, a catalyst addition treatment, and a catalyst activation treatment are conducted. The process for forming the electroless nickel layer is divided into two steps. Inthe first step, an electroless nickel-plated layer having a larger thickness than that formed in the second step is formed, and the resulting layer is subjected to a heat treatment. In the second step, a procedure for forming an electroless nickel-plated layer is conducted again. The method enables to increase the adhesion after thermal aging (i.e., after allowing to left in the atmosphere at 150DEG C for 168 hours) without deteriorating the initial adhesion which is a measure of the adhesion force of a non-adhesive flexible laminate.

Description

Method for producing metal-clad polyimide resin substrate excellent in thermal aging resistance technical field The present invention relates to a method for producing an adhesive-free flexible laminate used as a mounting material for electronic components such as flexible printed circuit boards, TABs, and COFs, especially a metal-clad polyimide resin substrate excellent in heat aging resistance. Background technique FCCL (Flexible Copper Clad Laminate), which is formed by laminating a metal conductor layer mainly containing copper on a polyimide film, is widely used as a raw material for circuit boards in the electronics industry. Among them, an adhesive-free flexible laminate (particularly a two-layer flexible laminate) that does not have an adhesive layer between a polyimide film and a metal layer has attracted attention as circuit wiring widths have become finer pitches. As a method of manufacturing adhesive-free flexible laminates, especially adhesive-free flexible l...

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Problems solved by technology

In addition, it has been proposed to use a Ni-P system electroless nickel plating solution as a commonly used electroless nickel plating solution. Although the formed Ni-P system electroless nickel coating film has excellent corrosion resistance, it also has poor etching properties and is difficult to form fine patterns. question

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