Lead-free solder

Abstract

The invention relates to a lead-free solder which is characterized by comprising the following raw materials by the weight percent: 5-15 of Zn, 0.05-1.0 of Cu, 10-15 of Bi, 0.1-0.5 of Sb, 0.001-0.02 of In, 0.001-0.1 of La and the balance of Sn. The lead-free solder has the advantages and the effects of low cost, low melting point and good oxidation resistance and mechanical property.

Description

technical field [0001] The invention relates to a lead-free solder, which belongs to soldering materials. technical background [0002] Traditional tin-lead solder has good solderability and low price, and has been widely used in industry for many years. However, lead and its compounds are toxic and harmful substances that endanger human health and pollute the environment. The European Union issued the ROHS directive. From July 1, 2006 Electrical and electronic products entering the EU market in the future must not contain six toxic substances such as lead and mercury. Therefore, lead-free solder will replace traditional tin-lead solder. The currently used lead-free solder is mainly SnCu, SnAg, and SnZn binary alloys. system and SnAgCu ternary alloy system, or more multi-element alloy solder based on this, but some Ag uses a large amount, which is easy to cause new pollution, and some cost is high, and some melting points are too low or too high. The process is more complic...

AI Technical Summary

Problems solved by technology

[0002] Traditional tin-lead solder has good solderability and low price, and has been widely used in industry for many years. However, lead and its compounds are toxic and harmful substances that endanger human health and pollute the environment. The European Union issued the ROHS directive. From July 1, 2006 Electrical and electronic products entering the EU market in the future must not contain six toxic substances such as lead and mercury. Therefore, lead-free solder will replace traditional tin-lead solder. The currently used lead-free solder is mainly SnCu, SnAg, and SnZn binary alloys. system and SnAgCu ternary alloy system, or more multi-element alloy solder based on this, but some Ag uses a large amount, which is easy to cause new pollution, and some cost is high, and some melting points are too low or too high. The process is more complicated

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