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Hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon

A technology of flexible printing and conductive adhesive, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc. It can solve the problems of hard boards that cannot be bent, defective products, AG wire breakage, etc., and achieve regular distribution of conductive particles, The effect of eliminating potential safety hazards and improving production efficiency

Active Publication Date: 2012-05-09
KUSN YIFUDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional PCB board is a rigid board. First of all, the characteristic of the PCB itself is that the rigid board cannot be bent, so it will inevitably occupy a certain amount of space and increase the weight of the product. Two disadvantages have restricted the product from becoming thinner and smaller. development strategy
In addition, from the perspective of technology, the touch screen of mobile phone adopts the process of pressing AG wire to realize the connection. If the hard board is too thick, it cannot be flattened after pressing, and the steps generated are large, and the AG wire will break.
[0004] Ordinary hollow flexible printed circuit board, because the product is too delicate after division, it is not easy to work in the process of glue coating and pressing, and the glue is not uniform, resulting in the appearance of steps and detachment after pressing AG, and, in the later stage There are potential safety hazards in the use of the products, and in the film-to-film pressing process, it is very easy to have defective products, low production efficiency, and high scrap rate

Method used

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  • Hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon
  • Hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon
  • Hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0024] figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention; figure 2 It is a schematic side view of an embodiment of the present invention.

[0025] Such as figure 1 with figure 2 As shown, a hollow flexible printed circuit board printed with ACP conductive glue includes a substrate 1 and a circuit formed thereon, the substrate 1 is pure copper foil, and the bottom surface of the substrate 1 is provided with a bottom surface with a solder joint opening 4 PI cover film, the surface of the substrate 1 has a pattern forming a circuit, and the top of the figure is provided with a surface PI cover film 2 that only exposes the upper solder joint opening 4, and the surface PI cover film 2 can also be provided with a PI cover film reinforcement 5, Both surface and bottom PI cover films 2, 2' and PI cover film reinforcement 5 contain Adhesive adhesive 3.

[0026] The above-mentioned surface PI covering film 2 , bottom surface PI c...

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Abstract

The invention discloses a hollow-out flexible printed circuit board with ACP conductive adhesive being printed thereon, which comprises a base plate and circuits formed on the base plate. The hollow-out flexible printed circuit board is characterized in that the base plate adopts pure copper foil; a layer of covering film with welding point openings is arranged on the bottom surface of the base plate; patterns forming the circuits are arranged on the upper surface of the base plate; a layer of covering film with only the welding point openings in the upper layer being exposed is pressed on thepatters; and a layer of ACP conductive adhesive is printed on the welding points on two surfaces. The hollow-out flexible printed circuit board has the advantages that the hollow-out flexible printedcircuit board can be freely bent, folded and wound and can be freely moved and stretched in the three dimensional space randomly, the heat dispersion is good, the flexible printed circuit board can be utilized to reduce the volume, and the light weight, the miniaturization and the slimming can be realized, thereby achieving the advantage of connection integration of element devices and conductingwires. The production operation is faster, the quality is more reliable, the environmental protection welding is realized, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a hollow flexible printed circuit board printed with ACP conductive glue suitable for a touch screen of a mobile phone. Background technique [0002] As we all know, with the development of science and technology, applied electronic products are gradually developing in the direction of lightness and multi-function, especially with the development of communication technology, mobile phones have become an indispensable part of people's daily life, and people's personalization of mobile phones Requirements continued to increase, and mobile phones with touch screens followed. [0003] The traditional PCB board is a rigid board. First of all, the characteristic of the PCB itself is that the rigid board cannot be bent, so it will inevitably occupy a certain amount of space and increase the weight of the product. Two disadvantages have restricted the product from becoming thinner and smaller....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K1/11H05K3/00
Inventor 陆申林彭罗华王恒忠汤彩明耿侠丁毅
Owner KUSN YIFUDA ELECTRONICS
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