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Printed circuit board and method for installing component thereon

A technology of printed circuit boards and components, which is applied to printed circuit parts, printed circuits assembled with electrical components, printed circuits connected with non-printed electrical components, etc., can solve the problem of low utilization of effective area and achieve reduction The effect of surface area and component density

Inactive Publication Date: 2009-10-07
SAMSUNG ELECTRONICS SUZHOU SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the defects of the low effective area utilization rate of the printed circuit board in the prior art, and provide a printed circuit board mounting structure and a method for installing components on the printed circuit board. The printed circuit board of the present invention Board mount structure and mounting method reduce the area occupied by components on the printed circuit board

Method used

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  • Printed circuit board and method for installing component thereon
  • Printed circuit board and method for installing component thereon
  • Printed circuit board and method for installing component thereon

Examples

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Embodiment Construction

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0016] refer to figure 2 and image 3 A mounting structure of a printed circuit board and a method of mounting components on a printed circuit board according to exemplary embodiments of the present invention will be described.

[0017] Refer below image 3 An example of a printed circuit board and a method for mounting components on a printed circuit board according to an embodiment of the present invention will be specifically shown.

[0018] refer to image 3 , the printed circuit board 100 includes: a substrate 102 made of an insulating material; a conductive layer 101 formed on the upper surface and a lower surface of the substrate 102; at least one through hole 110 formed through the substrate 102 and the conductive layer 101; to be installed Components (for example, resistors, capacitors, exclusion, etc.) 120 are vertically placed in the through ho...

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PUM

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Abstract

The invention discloses a printed circuit board and a method for installing a component thereon; the printed circuit board comprises a substrate, conducting layers which are formed on the upper surface and the lower surface of the substrate, at least one through hole which passes through the substrate and the conducting layers, and a component which is arranged in the through hole; the two ends of the component are respectively and electrically connected with the conducting layers formed on the upper surface and the lower surface of the substrate.

Description

technical field [0001] The invention relates to a printed circuit board. More particularly, the present invention relates to a method of mounting components in through-holes of a printed circuit board which reduces the surface area occupied by the components on the printed circuit board. Background technique [0002] With the development of surface mount technology (SMT), the number of components on the surface of the printed circuit board (PCB) is gradually increasing, the density of components is increasing, and the effective use area of ​​the printed circuit board is getting smaller and smaller. [0003] Below, refer to figure 1 To illustrate the surface area occupied by components mounted on a printed circuit board. figure 1 is a mounting method according to the prior art, taking a resistor with a size of 1.0×0.5×0.5 mm (millimeter) as an example, and calculating the surface area of ​​the printed circuit board to be occupied by the resistor mounted on the printed circu...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/18H05K3/34
Inventor 丁飞宇金星
Owner SAMSUNG ELECTRONICS SUZHOU SEMICON
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