High-entropy alloy solder used for welding copper and aluminum and preparation method thereof

A technology of high-entropy alloys and solders, applied in welding equipment, welding/cutting media/materials, welding media, etc., to achieve the effects of easy processing and assembly, good corrosion resistance, and simple process

Inactive Publication Date: 2009-10-14
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, people have carried out a lot of research on the control of solder composition and forming technology by applying high technology, and have prepared amorphous and microcrystalline solder with strong gap filling ability an

Method used

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  • High-entropy alloy solder used for welding copper and aluminum and preparation method thereof

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0022] The preparation method of the high-entropy alloy solder of the present invention uses a single-roller rapid solidification device to prepare, and the device structure is as follows figure 1 As shown, a copper roller 8 driven by a single-phase asynchronous motor 7 is provided in the vacuum chamber 5, a high-frequency induction coil 6 is arranged directly above the roller 8, and a high-frequency induction coil 6 is provided in the high-frequency induction coil 6 A cylindrical quartz crucible 2, the lower end of the crucible 2 is provided with a 0.3 ± 0.05mm wide slit nozzle parallel to the roller 8, the vacuum chamber 5 is provided with a vacuum pump 11 to communicate with the outside; on the top plate of the vacuum chamber 5 is provided with Small vacuum chamber 1, the small vacuum chamber 1 has an Ar gas inlet, the bottom of the small vacuum chamber 1 communicates with the upper opening of the crucible 2, and a collection chamber 3 is arranged on the side of the vacuum ...

Embodiment 1

[0033] Embodiment 1: select each component element and control according to the data in table 1, implement according to the following steps,

[0034] Step A, melting the master alloy: Weighing each high-purity metal Ti, Al, Fe, Cu, Ni, Co, Sn, and adding element Bi, and melting it in an ultra-high vacuum electric arc furnace,

[0035] A1. First, purify various high-purity metals with boron anhydride, and then weigh each high-purity metal according to the atomic percentage in Table 1;

[0036] A2, the various high-purity metals weighed in step A1 are respectively melted according to the combination of Cu-Sn, Cu-Ni, Ti-Al, Fe-Co-added elements, and four groups of master alloys are obtained;

[0037] A3, the four groups of master alloys melted in step A2 are combined according to Cu-Sn and Cu-Ni, Ti-Al and Fe-Co-additional elements for secondary fusion to obtain two groups of secondary master alloys;

[0038] A4, the two groups of secondary master alloys Cu-Sn-Ni and Ti-Al-Fe-Co...

Embodiment 2

[0041] Example 2: According to the steps of the above-mentioned Example 1, the elements and contents of each component are selected according to the data in Table 1, and the surface speed of the roll is controlled at 10m / s, and an amorphous high-entropy alloy with a thickness of about 50 μm can be prepared Brazing foil. Applying the high-entropy alloy solder foil, the T 2 Pure copper and 6061 aluminum alloy are welded, and the tensile and shear strength of the joint is about 139.5MPa, reaching the nominal strength of 6061 aluminum alloy (σ b = 77.5% of 180MPa).

[0042] Table 1 is the data sheet of each embodiment

[0043] Component content

[0044] Example 1

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Abstract

The invention discloses a high-entropy alloy solder used for welding copper and aluminum, which comprises the components according to the atomic percent with the total percentage being 100%: 6-14% of Ti, 10-20% of Al, 10-20% of Fe, 15-25% of Cu, 10-18% of Ni, 6-14% of Co, 0.5-4.5% of Sn and 0.03-3.5% of addition element, wherein, the addition element is one selected from Bi, Ga, In or RE. The invention also discloses a preparation method of the high-entropy alloy solder foil, which adopts stepwise smelting technique and a single-roller rapid solidification device to prepare the high-entropy alloy solder foil. The high-entropy alloy solder has good flexibility and is convenient for processing and assembly; when in welding, the high-entropy alloy solder has good metallic matching property with Al and Cu; the soldering seam is good in corrosion-resistant performance, the welding seam is single-phase fcc solid solution tissue, no friable intermetallic compound is generated, and the comprehensive mechanical property of joints can be remarkably improved; the preparation method of the high-entropy alloy solder has simple technique and low manufacturing cost.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and relates to a high-entropy alloy solder used for welding copper and aluminum, and also relates to a preparation method of the alloy solder. Background technique [0002] The global scarcity of copper resources has aroused strong concern from the international community. It is urgent to find copper substitutes. The electrical and thermal properties of aluminum are relatively close to copper, so it is a suitable copper substitute material. my country is a country rich in copper and aluminum. " "Substituting aluminum for copper" is the best choice to give full play to my country's resource advantages. The technical key of "replacing copper with aluminum" is to solve the welding problem between aluminum and copper. There are large differences between them, and they are easy to react with each other to form a hard and brittle intermetallic compound phase, which not only affects the perfor...

Claims

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Application Information

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IPC IPC(8): B23K35/24B22D11/06B22D11/10C22C1/03
Inventor 翟秋亚徐锦锋
Owner XIAN UNIV OF TECH
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