Chip encapsulation structure and support device thereof

Abstract

The invention relates to a chip encapsulation structure and a support device thereof. The chip encapsulation structure comprises a chip, a flexible base plate and a support device, wherein the chip is provided with an active surface, and the central position of the active surface comprises an induction area. The flexible base plate is provided with a chip covering area in which a corresponding area and a line idle area are arranged, and the line idle area encircles the outside of the corresponding area. The support device comprises at least one virtual leading wire and a plurality of virtual convex blocks, at least one of the virtual leading wires is formed on the line idle area, and the virtual convex blocks are formed on the active surface. When the chip is electrically connected with the chip covering area and is positioned on the chip covering area, at least one of the virtual leading wires is at least jointed with the virtual convex blocks locally and correspondingly. The support device enables the flexible base plate to keep a preset planeness after encapsulation.

Description

technical field [0001] The present invention relates to a chip packaging structure and its supporting device; more specifically, it relates to a chip packaging structure and its supporting device capable of maintaining the flatness of a flexible substrate. Background technique [0002] A chip (chip) is composed of many integrated circuits (IC). With the advancement of integrated circuit design technology, chips are endowed with many different functions and are widely used in various daily necessities, such as financial cards and health insurance cards. , pet chip and so on. In recent years, many chips with identification functions have been developed to be combined with electronic products, for example, fingerprint identification chips are installed in notebook computers or mobile phones. [0003] Generally speaking, the active surface of these chips with identification function has a sensing area for sensing personal features, such as fingerprints, pupils, facial features,...

AI Technical Summary

Problems solved by technology

In other words, the technology disclosed in Taiwan Patent No. 462120 cannot solve the problems faced by the central area of ​​the chip packaging structure during the packaging process

In addition, since the technology disclosed in Taiwan Patent No. 462120 is a tape-and-reel carrier packaging technology, it cannot solve the difficulties faced by Chip on Film (COF) technology, for example, a chip with a sensing area in the central area After being packaged with thin film chip-on-chip packaging technology, the flexible substrate where the chip is placed shrinks and curls due to the heat of the thermocompression process, resulting in uneven surfaces, which in turn affects the sensing function of the sensing area

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