Heat dissipating device

Abstract

The invention relates to a heat dissipating device which is used for carrying out heat dissipating to heating electronic components of both sides of a circuit board. The heat dissipating device which comprises a pair of heat dissipating plates and clamping pieces clamping the two heat dissipating plates on both sides of the circuit plate, wherein the clamping piece comprises a connecting part and a pair of elastic clamping parts extending from two end parts of the connecting part; the surface of the outer side of each heat dissipating plate in the trailing direction of the circuit is punched to form a plurality of columns of heat dissipating pieces; a position for forming the heat dissipating pieces on each heat dissipating plate is provided with an opening; two opposite end parts of the two heat dissipating plates are mutually buckled; and the clamping parts clamp the two heat dissipating plates to recline on both sides of the circuit plate. The cost of punching the surface of the outer side of the heat dissipating plates to form the plurality of columns of the heat dissipating pieces is lower than traditional aluminium extrusion, the position extending the heat dissipating pieces on each heat dissipating plate is provided with the opening, the heating electronic components of both sides of the circuit plate dissipate heat through the heat dissipating pieces of the heat dissipating plates, meanwhile, airflow can blow to the heating electronic components through the corresponding opening on the position of the heat dissipating pieces, and then the heat dissipating efficiency of the heat dissipating device is further enhanced.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components on a circuit board. Background technique [0002] With the continuous development of the computer industry, the operating frequency and speed of electronic components such as central processing units and sound cards continue to increase, and the heat generated is increasing. If the heat is not dissipated in time, the accumulated heat will cause the temperature to rise and affect the normal operation of electronic components. . [0003] With the improvement of computer performance, the capacity of chips on boards such as memory sticks and graphics and sound cards is increasing day by day, the size is getting smaller and smaller, and the working speed is getting faster and faster. The heat generated in this process is constantly increasing. How to quickly replace the chips on these additional cards? Rapid and effective heat di...

AI Technical Summary

Problems solved by technology

[0004] Usually, the industry installs radiators on electronic components to assist in heat dissipation. Traditional radiators are mostly aluminum extruded radiators, which have a single structure and high cost

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