Large dimension micro-beam array for optical reading out heat type infrared radiation sensor

Abstract

The invention discloses a large dimension micro-beam array for optical reading out type infrared radiation sensor, comprising longitudinal beams and horizontal beams constructed by heat insulation material. Longitudinal beams are distributed in equal distance M along the X axis, horizontal beams are distributed in equal distance N along the Y axis, beam width W is 0.1-3 millimeter, beam thickness H is 0.2-150 millimeters, and the beam thickness H is 2-50 times of the beam width W. The invention provides micro-beam array easy to implement large dimension (over 1024*1024 pixels, each pixel having a dimension of 10*10-100*100 square micrometers), which is capable of effectively enhancing inherent frequency of micro-beam array, eliminating added reading out noise caused by micro-beam array lowfrequency vibration, eliminating Z direction acoplanarity displacement generated from heating the unit grid array, anti-impact and anti-shock capability of the micro-beam array is enhanced, structura l stability of the micro-beam array is enhanced, so that suitable environment of the micro-beam array is expanded.

Description

technical field [0001] The invention relates to a sensing element for acquiring and converting infrared radiation signals of objects, in particular to a large-size micro-beam array for optically reading thermal infrared radiation sensors. Background technique [0002] The infrared peak band radiated by room temperature objects (≈300K) is 8-14 microns, and the infrared radiation detectors for this band can be roughly divided into two categories: quantum type and thermal type. [0003] Quantum-type infrared radiation detectors need to use a liquid nitrogen cooling device to cool the target surface of the detector to a low temperature (≈77K), which makes the detector bulky, expensive, and difficult to maintain, which is not conducive to civilian use and popularization. [0004] Thermal infrared radiation detectors do not require liquid nitrogen cooling devices, are small in size, low in cost, and have high temperature resolution (50mK), so they have broad application prospects....

AI Technical Summary

Problems solved by technology

However, due to the low stiffness of the unit grid array, especially the very weak stiffness along the Z direction, the microbeam array based on the unit grid array has the following problems in terms of structural performance: 1. The natural frequency of the microbeam array is low , especially when the beam length L is greater than or equal to L 0 When the cell grid array is heated, its natural frequency is only tens of Hz, which is close to the signal readout frequency, resulting in additional low-frequency readout noise; 2. After the cell grid array is heated, it will produce Z-direction out-of-plane displacement, resulting in additional readout error ; 3. The structural stability of the unit grid array is poor, which leads to the weak impact resistance and seismic performance of the microbeam array, which restricts its application range to a certain extent

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