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Full-color SMD and encapsulating method thereof

An LED chip and frame technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as increased cost, process and quality problems, and yellowing

Inactive Publication Date: 2009-11-04
SHENZHEN JIUZHOU OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the PPA material is easily affected by the external temperature, humidity and ultraviolet rays, it will turn yellow, and when using PPA material for LED packaging, it is necessary to face the process of installing a heat sink when dissipating heat, which increases the production process. cost, workmanship and quality issues

Method used

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  • Full-color SMD and encapsulating method thereof
  • Full-color SMD and encapsulating method thereof

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Embodiment Construction

[0020] In order to illustrate the idea and purpose of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] Such as figure 1 As shown, a full-color SMD according to the present invention includes a green LED chip 9, a red LED chip 7 and a blue LED chip 8, and also includes a substrate, which is made of low temperature co-fired ceramic material LTCC In this way, the substrate is provided with a first lead frame 1, a second lead frame 2, a third lead frame 3, a fourth lead frame 4, a fifth lead frame 5, and a sixth lead frame 6, and these lead frames are here On the substrate, and form the electrical connection structure (PCB) on this substrate.

[0022] Such as figure 2 as shown, figure 2 for figure 1 Schematic enlarged view of A. Wherein the green LED chip 9 is fixedly mounted on the sixth lead frame 6 through an adhesive or other soldering agent, and one en...

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Abstract

The invention discloses a full-color SMD and an encapsulating method thereof. The full-color SMD is realized by mainly taking a low-temperature co-fired ceramic as a substrate, independently mounting a red LED chip, a blue LED chip and a green LED chip on a lead frame on the substrate to encapsulate the red LED chip, the blue LED chip and the green LED chip into a reflection cup and filling transparent material to a substrate electric structure and LED chips in the reflection cup for encapsulation to achieve a full-color effect; and the heat produced during working is radiated through the low-temperature co-fired ceramic substrate to cool the LED chips during working.

Description

Technical field: [0001] The invention relates to LED packaging technology, in particular to a packaging of full-color SMD light-emitting diodes (SMD) manufactured using low-temperature co-fired ceramics (LTCC) as a substrate material. The package is placed in a reflective cup, and the full-color effect is realized through the electrical structure in the package, and the heat generated during its working process is transferred out through the substrate material - low temperature co-fired ceramics. Background technique: [0002] Since the light-emitting diode (LED) has the characteristics that the brightness decreases linearly and inversely proportional to the increase of temperature, and the life span decreases exponentially with the increase of temperature, so in order to improve the reliability and life of the LED, it is necessary to reduce the temperature when the LED emits light. There are mainly the following ways to reduce the temperature of the LED when it is working: ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/075H01L23/488H01L23/495H01L23/36H01L21/50H01L21/60
CPCH01L2224/45144H01L2224/48091
Inventor 杨华明季伟张岁萍邓维增肖从清黄科
Owner SHENZHEN JIUZHOU OPTOELECTRONICS TECH