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Method for fabricating resin composition for semiconductor packaging

A resin composition and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of changing the physical properties of resin compositions, separation of blending components, etc., to achieve stable physical properties, prevent components separation effect

Inactive Publication Date: 2009-11-18
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, although the mixture is fed into the melt kneader 1 from the hopper 2, a part of the blended ingredients may segregate in the hopper 2
As a result, there arises a problem in that the compositional ratio of the obtained resin composition may be changed in the initial stage and the final stage of the melt-kneading operation, thereby changing the physical properties of the resin composition
However, since the hoppers 2 used so far in the prior art have many different shapes, it is problematic to change the manufacturing conditions for each different-shaped hopper in consideration of production efficiency.

Method used

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  • Method for fabricating resin composition for semiconductor packaging
  • Method for fabricating resin composition for semiconductor packaging
  • Method for fabricating resin composition for semiconductor packaging

Examples

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Embodiment 1-4

[0073] Embodiment 1-4, comparative example 1-4

[0074] Table 1 shows the compositions of the resin compositions I and II for semiconductor element encapsulation produced in Examples 1-4 and Comparative Examples 1-4. Among the ingredients shown in Table 1, an epoxy resin (ingredient A) and a curing agent (ingredient B) were mixed and pulverized under different conditions. In Examples 1-4, a turbo mill was used as a pulverizer; in Comparative Examples 1-4, a hummer mill was used. As a result, a resin blend of an epoxy resin (ingredient A) and a curing agent (ingredient B) having an average particle size as shown in Table 2 and Table 3 was prepared.

[0075] The resin blend, and the inorganic filler (ingredient C) shown in Table 1 and other additives were mixed in the ratio shown in Table 1, making it a total of 100 kg as a whole, and mixed by using a Henschel (Henschel) mixer ( Capacity, 200L) was dispersed as a mixer for 2 minutes to prepare a mixture.

[0076] By the way, ...

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Abstract

The present invention relates to a method for fabricating a resin composition for semiconductor packaging, wherein the resin composition comprises the following components (A) to (C): (A) epoxy resin;(B) curing agent; and (C) inorganic filler. The method comprises the following steps: preparing a mixture which contains the components (A) and (B) with average granularities of 5-50 mu m and further contains the component (C); storing the mixture into a container which is used for sending the mixture to a melting mixing roll; sending the stored mixture from the container to the melting mixing ro ll thereby preparing the mixed material; cooling and curing the mixed material, and finally crushing.

Description

technical field [0001] The present invention relates to a method for manufacturing a resin composition for semiconductor element encapsulation, which is used for encapsulating semiconductor elements. Background technique [0002] So far, semiconductor components such as transistors, ICs, LSIs, etc. have been packaged with resin compositions including epoxy resins, curing agents, and inorganic fillers. Generally, in producing a solid resin composition for encapsulation of a semiconductor element, a method comprising mixing and melt-kneading the constituent components, thereafter rolling the mixture, cooling and solidifying it, and pulverizing it has hitherto been used (JP-A 2007 -77333, JP-A 2006-297701 and JP-A 2001-64398). [0003] In the process of producing a resin composition, a mixture of a large number of constituent components is prepared in advance in order to increase production efficiency, and is fed into a melt kneader to continuously melt and knead the mixture. ...

Claims

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Application Information

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IPC IPC(8): C08L63/00H01L23/29
CPCB29B7/90B29B7/007B29B7/38B29B9/06B29B9/12C08J3/203C08J2363/00C08J3/12C08K2201/005C08K3/36C08L63/00C08K7/18H01L23/295
Inventor 大野博文木村祥一山根实
Owner NITTO DENKO CORP
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